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SiC Ingot Slicing
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SiC Is Expected to Be Used Increasingly in Power Semiconductors
Mar 13, 2013Mitsubishi Electric Corporation announced this week that it has developed a prototype multi-wire electrical discharge processing technology to cut very hard four inch square polycrystalline silicon carbide (SiC) ingots into 40 pieces at ...
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Mitsubishi Has Developed a Prototype Multi-Wire Electrical Discharge Processing Technology
Feb 11, 2013Tokyo-based Mitsubishi Electric Corp says that it has developed a prototype multi-wire electrical discharge processing technology to cut very hard 4-inch polycrystalline silicon carbide (SiC) ingots into 40 pieces simultaneously. Up to ...
