TEL NEXX

The Next-Generation Power Semiconductor Market to Increase
Oct 16, 2014
The next-generation power semiconductor market will increase at a compound annual growth rate (CAGR) of 63% between 2011 and 2017 to more than $500m, forecasts market research firm The Information Network in its report 'Next-Generation ...

Tags: Power Semiconductor, Electronics
TEL NEXX Signed an Agreement with IBM to Develop a 3D Semiconductor Packaging Programme
Dec 11, 2012
The new programme focuses on meeting IBM's technology requirements through its partners in the Semiconductor Research and Development Alliance TEL NEXX, a subsidiary of Tokyo Electron U.S. Holdings has signed a new multi-year ...

Tags: semiconductor research, 3D semiconductor packaging programme, IBM
US-based TEL NEXX has announced that it entered into a pact with IBM
Nov 30, 2012
US-based TEL NEXX, a wholly owned subsidiary of Tokyo Electron US Holdings, has announced that it entered into a pact with IBM for a new multi-year joint development program in 3D semiconductor packaging. According to TEL Nexx, as 3D ...

Tags: TEL NEXX, IBM, 3D semiconductor packaging