Wafer Substrate articles & resources on Made-in-China.com

Infineon to Acquire Wolfspeed for $850m

Jul 16, 2016

Infineon Technologies AG of Munich, Germany has entered into a definitive agreement to acquire the Wolfspeed Power & RF division of Cree Inc of Durham, NC, USA for $850m in cash (about €740m). The deal also includes the related silicon ...

Tags: Cree, Wolfspeed, Infineon

Wafers and Substrates Are Thinned Down From as Much as 750um

Sep 9, 2014

As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the thickness of these devices, and hence the thickness of the dies and wafers, says AI Technology Inc (AIT) of Princeton Junction, ...

Tags: Bonding Wax, Back-Grinding

AKHAN Has Been Granted Exclusive Diamond Semiconductor to Low-Temperature Diamond

Mar 6, 2013

AKHAN Technologies Inc of Hoffman Estates, IL, USA has been granted exclusive diamond semiconductor application licensing rights to low-temperature diamond deposition technology developed by the Center for Nanoscale Materials (CNM) at the ...

Tags: diamond deposition technology, diamond semiconductor, semiconductor

"PLANSEE High Performance Materials" Has Developed a Molybdenum-Copper Composite Material

Mar 8, 2012

With Mo-Cu R670, “PLANSEE High Performance Materials” has developed a new molybdenum-copper composite material for semiconductor wafer substrates. The high thermal conductivity of MoCu R670 ensures optimized heat dissipation in ...

Tags: Market View, led chip, raw material, Wafer Substrate

PLANSEE High Performance Materials' Has Developed a New Composite Material