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Disco Develops Laser Ingot Slicing Method to Speed Sic Wafer Production and Cut Material Loss
Aug 12, 2016Tokyo-based equipment maker Disco Corp has developed the KABRA (Key Amorphous-Black Repetitive Absorption) laser ingot slicing method. Implementing the process is said to enable high-speed production of silicon carbide (SiC) wafers, ...
Tags: SiC, Disco Corp, laser ingot slicing method