packaged aluminium

Taiwan Researchers Claim to Bumping Technology to Create Piezoelectric-Induced Performance
Jul 7, 2014
Researchers in Taiwan claim to be the first to use bumping technology to create piezoelectric-induced performance enhancement in flip-chip packaged aluminium gallium nitride (AlGaN) high-electron-mobility transistors (HEMTs) [Szu-Ping Tsai ...

Tags: Nitride Semiconductor, packaged aluminium