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Plessey Orders Aixtron AIX G5+ C MOCVD System for GaN-on-Si Monolithic Micro-LEDs

Sep 21, 2018

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for an AIX G5+ C Planetary Reactor metal-organic chemical vapor deposition (MOCVD) system from UK-based Plessey Semiconductors to boost its ...

Tags: micro-LED, LED

US Air Force's GaN Technology to Be Transferred to Bae Systems Advanced Microwave Products Center

Sep 21, 2018

BAE Systems has signed a cooperative agreement with the US Air Force Research Laboratory (AFRL) for Phase 1 of a technical effort to transition gallium nitride (GaN) semiconductor technology developed by the US Air Force to its Advanced ...

Tags: Microwave Products, GaN Technology

Plessey and JDC Collaborate on Tailored Backplane for Monolithic Micro-LED Displays

Sep 17, 2018

Plessey Semiconductors Ltd of Plymouth, UK has announced a strategic partnership for its own monolithic micro-LED displays – manufactured on its proprietary gallium nitride on silicon (GaN-on-Si) wafers – to be driven by the ...

Tags: Micro-LED Displays

EpiGan Showcasing GaN Epiwafer Solutions for 5G

Aug 31, 2018

In booth J2554 of its local agent APEC at the SEMICON Taiwan show in Taipei (5-7 September) and in booth 354 at European Microwave Week (EuMW 2018) in Madrid, Spain (23-28 September), EpiGaN nv of Hasselt, near Antwerp, Belgium - which ...

Tags: GaN Epiwafer, epitaxial wafer

ClassOne's Solstice Coppermax Electroplating System Chosen by China's Largest GaAs Device Maker

Aug 27, 2018

ClassOne Technology of Kalispell, MT, USA (which manufactures electroplating and wet-chemical process systems for ≤200mm wafers) has announced a multi-tool sale of its flagship Solstice CopperMax electroplating system to China’s ...

Tags: compound semiconductor, semiconductor

Sanan IC Extends III-V Foundry From Greater China to North American, European and APAC Markets

Aug 27, 2018

Sanan Integrated Circuit Co Ltd (Sanan IC) of Xiamen City, Fujian province (China’s first 6-inch pure-play compound semiconductor wafer foundry) has announced its entry into the North American, European and Asia Pacific (APAC) markets ...

Tags: integrated passive device, filters

Integreat Project Yields New Approaches to LED Production

Jul 19, 2018

Results have been announced for the research project ‘Integrated High-Volume Production along the LED Value-Added Chain for Large Wafers and Panels’ (InteGreat), which ran between December 2014 and February 2018 supported by the ...

Tags: packaging, LED product

Micro-LED & Mini-LED Applications to Account for 11.4% of LED Wafer Volume by 2022

Mar 27, 2018

While conventional LEDs are used for backlighting, micro-LED and mini-LED technology has been used for self-emitting in displays of consumer electronics. Since each LED represents a pixel (increasing the number of LED wafers used), wafers ...

Tags: LED market, LED Wafer

Air Products to Launch New Flux-Free Soldering Technology for Wafer Level Packaging Applications

Feb 22, 2018

Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...

Tags: Air Products, Wafer Level Packaging

Taiwan LED Makers Shifting Focus to IR and Sensing Devices as China Expands for LED Lighting

Jan 15, 2018

To cope with increasing price competition in the blue LED segment, Taiwan-based LED packaging firms are shifting the focus of their production to infrared (IR) and sensing devices, reports Digitimes. China’s largest LED packaging ...

Tags: LED market, LED chips

Qualcomm Announces RF Front-End Design Wins with Google, HTC, LG, Samsung and Sony Mobile

Jan 15, 2018

Qualcomm Technologies Inc, a subsidiary of Qualcomm Inc of San Diego, CA, USA, has announced radio-frequency front-end (RFFE) design wins with leading original equipment manufacturers (OEMs) including Google, HTC, LG, Samsung and Sony ...

Tags: Qualcomm, Google

Lasertec Launches GALOIS GaN Wafer Inspection and Review System

Dec 7, 2017

Metrology and inspection equipment maker Lasertec Corp of Tokyo, Japan has launched the GALOIS defect inspection and review system series, designed specifically for the inspection and analysis of gallium nitride (GaN) wafers. The firm is ...

Tags: Metrology, inspection equipment

ClassOne Slashes Via Liner Plating Costs for Compound Semiconductors

Nov 22, 2017

ClassOne Technology of Kalispell, MT, USA (which manufactures Solstice electroplating systems for ≤200mm wafers), has unveiled a new plating technique that is said to provide significant cost reductions for compound semiconductor ...

Tags: Compound Semiconductors

Solar-Tectic Granted US Patent for Low-Cost, High-Efficiency III-V Thin-Film Tandem Solar Cell on Glass Substrate

Oct 10, 2017

Solar-Tectic LLC of Briarcliff Manor, NY, USA says that the US Patent and Trademark Office has granted it US patent 15/205,316 ‘Method of Growing III-V Semiconductor Films for Tandem Solar Cells’ for high-efficiency and ...

Tags: Thin-film PV, Glass Substrate

TSMC Profits From Surging Market Demand for Chips in Auto Application

Oct 9, 2017

Market insiders noted that TSMC (Taiwan Semiconductor Manufacturing Co.), the world's largest semiconductor foundry headquartered in Taiwan, will see a strong revenue performance as the firm won massive orders from multinational ...

Tags: TSMC, semiconductor

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