Wafer dicing process is one of the most popular methods of dicing in semiconductor industries. This is a process of separating a die from a wafer of semiconductor martial that is accomplished by using several methods like breaking and scribing, by laser cutting, or by mechanical sawing. Wafer dicing machine is used to cut individual semiconductor chips with the help of dicing blades. With the help of this process, the individual semiconductor chips AKA silicon chips are encapsulated into chip carriers that become suitable for use in building electronic devices such as computers, etc. Mainly, this process arises at the end of the wafer manufacturing to part the chips or after deposition of semiconductor based materials to isolate the device to characterize. The most diced are composed of semiconductor materials like silicon, but there are also some ceramics or glass supports that hold some microelectronic devices or layers and they may need to be cut too. In this complete process, silicon wafer dicing machine plays a vital role
There are a lot of advantages of wafer dicing machines. This user friendly PC based control system is used for dicing purpose in various industries. With its simple to input process parameter, this machine is very easy to use and requires less maintenance. There is a wide range of application uses of this machine due to its capability of contact and non-contact sensor for cutting depth control. This machine is equipped with blade wear-compensation and life-time counter that makes it highly advanced. Also, a special program for irregular pitch and depth device is available in this machine. Apart from this, a joystick axis controller is also available in thus machine for easy alignment.
This machine is widely used in laser dicing fiber laser marking, and laser scribing. Mostly, this machine is used to aid in the production of materials that requires a high level of precision such as in military equipment, aerospace parts, and other engineering accessories. In these products, precision is very important because even a slight deviation from the design could have expensive or even dangerous consequences. There is also Piezo ceramic machining for medical equipment in pharmaceutical industries that is used for dicing surgical equipment. These machines are particularly used if you deal with manufacturing large volume of medical devices. Without the help of this machine, there is a risk of massive losses due to the lack of precision.
