The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical technology. Under the MSA, 22 participating companies are addressing the technical challenges ...
Tags: Nokia, Microsoft, Optical Links
Lake Image Systems will showcase its full range of inspection solutions at this month’s Label Expo Europe in Brussels. The company said that its solutions mainly address the challenges in inspection needs in the conventional and ...
Tags: Lake Image, Label Expo 17
As part of the Special Session program at the IEEE Energy Conversion Congress & Expo (ECCE 2017) in Cincinnati, OH (1–5 October), the Power Electronics Industry Collaborative (PEIC) – a national, industry-focused member-based ...
Tags: semiconductor, supply chain
Bosch Packaging Technology is set to unveil two new vertical solutions at the Pack Expo event in Las Vegas, US. The event will take place between 25 and 27 September. At the event, the company will exhibit two solutions, of which first ...
Tags: Bosch Packaging, Packaging
French automaker Renault will be showcasing a new concept – Symbioz – at the 2017 Frankfurt Motor Show to be held on 12 September. Renault stated that Symbioz will culminate autonomous, electric and connected mobility ...
Tags: Frankfurt Motor Show, Renault
Researchers at Nanyang Technological University, Singapore (NTU Singapore) have used brewery waste to grow yeast required to make beer. A new process has been invented by scientists to turn spent brewery grains into a product that can ...
Tags: Liquid Nutrient, beer
Domino Digital Printing Solutions is introducing a new fluorescent security ink for its K600i piezo drop on demand ink jet printer at Labelexpo Europe 2017. The UV80CL ink will be useful for security printing and brand protection, ...
Tags: Ink Jet Printer, Printer
Flexible packaging firm Uflex has unveiled new aseptic filling machine, Asepto Smart 78, at this year’s PackEx India event. The event has been conducted from 21 to 23 August in New Delhi. The new advanced filling machine has a ...
Tags: PackEx India 2017, packaging
Technology giant IBM has collaborated with food giants across the globe over a blockchain solution in an effort to reduce food borne illness and get rid of food contamination. The consortium includes food companies Dole, Driscoll’s, ...
Tags: food contamination
Epson America and Loftware have partnered to support the increasing demand for color label printing. As a part of the collaboration, Loftware is delivering native print drivers which use EPSON ESC/Label language to drive the Epson ...
Tags: Epson, Label Solution
Extrusion technology provider KraussMaffei Berstorff says that its newly designed extruder models for pelletizing are bagging orders worldwide in both PVC and PO segments. The company claims to be registering significant growth in orders ...
Tags: Kraussmaffei Berstorff, Extruder
Mondi said it will show how its packaging solutions are addressing industry and consumer trends at the 2017 Pack Expo trade fair, which is due to be held from September 25 to 27, 2017 at the Las Vegas Convention Center in the US. At the ...
The US Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E) has announced $30m in funding for 21 projects as part of the CIRCUITS program (‘Creating Innovative and Reliable Circuits Using Inventive Topologies ...
Tags: WBG devices, electronics devices
The UK's Competition and Markets Authority (CMA) has given its approval for the takeover of Punch Taverns by Dutch brewing giant Heineken. In June this year, the CMA raised the issue of affecting competition in 33 places in the UK, if ...
MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics