Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has launched the UltraCMOS PE42525 and PE426525, which are claimed to be the first RF SOI switches to operate up to 60GHz. The firm says that the two switches significantly extend its high-frequency portfolio into frequencies previously dominated by gallium arsenide (GaAs) technology.
Supporting a wide frequency range from 9kHz to 60GHz, the PE42525 and PE426525 are reflective single-pole double-throw (SPDT) RF switches delivering a fast switching speed of 8ns and RF TRISE/TFALL time of 4ns, and low power consumption of 450nA. At 50GHz, the PE42525 and PE426525 exhibit high port-to-port isolation of 38dB, low insertion loss of 1.9dB, high power handling, high linearity, and ESD protection of 2kV HBM. The PE426525 has an extended temperature range that spans -55°C to +125°C.
The PE42525 is suitable for test & measurement equipment, microwave-backhaul solutions and higher-frequency switching in 5G systems. The PE426525 has an extended temperature range, making it suited to harsh-environment applications such oil & gas exploration and other industrial markets.
"From 26.5GHz to 40GHz and now 60GHz, Peregrine's high-frequency portfolio continues to reach frequencies and performance levels previously considered unattainable in RF SOI," says director of marketing Kinana Hussain. "The PE42525 and PE426525 are proof that RF SOI can deliver a high-performing, reliable and fast switching solution at microwave frequencies. As more applications demand higher-frequency products, Peregrine will continue to break more barriers in RF SOI."
The new 60GHz switches join Peregrine's high-frequency product portfolio, which includes multiple switches, an image-reject mixer, and monolithic phase and amplitude controllers (MPACs). Its proprietary UltraCMOS technology platform enables these products to reach high frequencies without compromising performance or reliability, the firm adds.
The PE42525 and PE426525 are each available as a flip-chip die with 500μm bump pitch — reckoned to be the best form factor for high-frequency performance, as it eliminates performance variations due to wire-bond length.
Samples and evaluation kits are available now. For 1000-unit orders, the PE42525 die costs $40 each and the PE426525 $48 each.
