Germany-based adhesives manufacturer Henkel has developed a new hotmelt adhesive - Technomelt Supra 100 Cool which is designed for application in the food industry.
According to the company, with an application temperature of 100 °C, Technomelt Supra 100 Cool delivers higher efficiency in packaging production while also promoting sustainability in customer operations.
The adhesive is also characterized by its wide-ranging suitability in case sealing, carton closing and tray erection. It reduces the energy requirement compared to conventional hotmelts by up to 50%.
Technomelt Supra 100 Cool's other benefits include heat resistance and cold flexibility, which enables its use for both warm-filling and deep-freeze applications.
With this new low-temperature packaging adhesive, Henkel combines innovation with sustainability, further demonstrating its commitment to progress in support of the packaging sector and the consumer goods industry.
