RF front-end component maker TriQuint Semiconductor Inc of Hillsboro, OR, USA says that its TQP9059, a versatile multi-mode, multi-band power amplifier (MMPA) module with envelope tracking, has earned an award in the Outstanding RF/Wireless/Microwave Products of the Year category at the 2014 China Annual Creativity in Electronics (ACE) Awards.
The highly integrated module not only prolongs battery life with new envelope tracking technology but also simplifies complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners, says TriQuint. The device is designed on the firm’s gallium arsenide (GaAs) heterojunction biploar technology (HBT) technology with CuFlip assembly offering what is claimed to be state-of-the-art reliability, temperature stability and ruggedness. Its RF performance meets the stringent linearity, noise and harmonics requirements for multi-mode operation while simultaneously offering a system current consumption lower by 50mA than the nearest competitor, it is reckoned, thus improving battery life.
"For a second year in a row, TriQuint has been recognized by China ACE for our continuing contributions to China’s electronics industry,” says Locker Jiang, TriQuint’s China sales director for Mobile Products. “The TQP9059’s designation as one of the top products in the semiconductor space is a direct reflection of TriQuint’s ongoing commitment to drive innovation and simplify RF design.”
The TQP9059 is one of the earliest envelope tracking MMPAs to be in mass production supporting a leading smartphone, TriQuint claims. The product is included on reference designs by multiple chipset manufacturers and is being designed into next-generation smartphones from multiple OEMs.
The China ACE Awards are presented by Global Sources’ electronics industry titles EE Times-China, ESM-China and EDN-China.
