10 October 2012
Shenyang Silicon Technology opts for EV Group's EVG850LT 300-mm SOI production bonding system
EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography equipment,says that China-U.S.joint-venture Shenyang Silicon Technology Co Ltd(SST)has installed one of its EVG850LT 300-mm,low-temperature automated production bonding systems for silicon-on-insulator(SOI)materials.The system,which has already shipped to SST's facility,marks the first installation in China of a 300-mm SOI wafer production tool,says EVG.
"As we look to advance our ability to produce 300-mm SOI wafers in high volumes,we need technology that offers the same degree of reliability,throughput and quality as we experienced with our prior EVG bonder[a 200-mm EVG850LT],so adding a 300-mm version of the EVG850LT to our line was an easy decision to make."said Prof.He ZhiQiang,CEO of SST.
With the EVG850LT SOI production bonding system,all essential steps for low-temperature SOI bonding,from cleaning and alignment to pre-bonding and IR inspection,are combined to assure a high-yield production process for void-free 300-mm wafers,adds the firm.
Swen Zhu,director of sales for EV Group in China,said,"The demand for SOI-based devices continues to grow at a rapid pace,particularly in emerging markets such as China,creating more opportunity for EVG to extend our relationships with our customers producing SOI wafers."
