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SOI wafers
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Three-Year €33m European Project Reference to Extend RF-Soi Technology for Above-1GB/S 4G+ Wireless Front-End Modules
Jul 12, 2016The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
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SOI Wafer Maker Soitec Refutes Sigen's Patent Infringement Complaint to ITC
Dec 11, 2015Soitec of Bernin, near Grenoble, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers, says that it is defending its rights in an investigation by the US International Trade Commission (ITC) instituted on 18 ...
Tags: Soitec, SOI, Engineered substrates
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Leti and European FP7 Project Partners in Silicon Photonics Supply-Chain Announce Developments on Three Mature Platforms
Nov 24, 2015CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon ...
Tags: Leti, Silicon Photonics
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PLAT4M Silicon Photonics Supply-Chain Project Develops Three Mature Platforms
Nov 24, 2015Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and its partners say that they have built three silicon photonics platforms, as they reach the mid-point of the four-year European Union Seventh Framework Program (EU FP7) project ...
Tags: Leti, silicon photonics, STMicroelectronics
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X-FAB Has Announced The First Cost-Efficient 180nm SOI Technology
Jul 7, 2015X-FAB Silicon Foundries AG of Erfurt, Germany - an analog/mixed-signal and micro-electro-mechanical systems (MEMS) foundry - has announced what it claims is the first cost-efficient 180nm silicon-on-insulator (SOI) technology for automotive ...
Tags: X-FAB, SOI, electrical components
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X-FAB Announced The First180nm Soi Technology for Automotive and Industrial Aplications
Jun 29, 2015X-FAB Silicon Foundries, the leading More than Moore foundry, has announced the industry’s first cost-efficient 180nm SOI technology for automotive and industrial applications that need to operate in harsh environments. X-FAB's new ...
Tags: X-FAB, SOI technology, high-voltage devices, auto accessories
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Soitec Announces a Definitive Agreement to Sell Its Solar System Business
May 28, 2015Soitec of Bernin, near Grenoble, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers, has announced a definitive agreement to sell its solar system business - including all technology assets and ...
Tags: Soitec, Core Semiconductor
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Sale of Gaas Epitaxy Business of Its Soitec Specialty Electronics Subsidiary to IntelliEPI
Sep 30, 2014Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, has announced the sale of the gallium arsenide (GaAs) epitaxy business of its Soitec Specialty Electronics ...
Tags: sale of GaAs, IntelliEPI, Electronics
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Soitec Renewed Their Long-Standing Partnership for The Next Five Years
Dec 20, 2013Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, and CEA (the French Atomic and Renewable Energy Commission) have renewed their long-standing partnership for the ...
Tags: Soitec of Bernin, Electrical
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Soitec Uses Molecular Beam Epitaxy to Manufacture Indium Phosphide
Dec 16, 2013Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers and III-V epiwafers, and Intelligent Epitaxy Technology Inc (IntelliEPI) of Richardson, TX, USA, which uses molecular beam epitaxy (MBE) ...
Tags: IntelliEpi, Soitec, engineered substrates, GaAs
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EVG Has Ordered an EVG850lt Fully Automated Production Bonding System
Dec 12, 2013EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for MEMS (microelectromechanical systems), nanotechnology and semiconductor applications, says that the Singapore-MIT Alliance for Research ...
Tags: EV Group Bonding, Wafer Bonding
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Soitec Entered Into a Patent Cross-License Agreement
Nov 29, 2013Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - and silicon wafer manufacturer SunEdison Inc of St. Peters, MO, USA have entered into a patent cross-license ...
Tags: Soitec SOI engineered substrates, Electrical, Electronics
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Alstom and Soitec Signed a Cooperative Agreement to Provide CPV Power Plants
Jul 31, 2013Power generation and transmission firm Alstom and Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - as well as concentrating photovoltaic (CPV) solar systems, ...
Tags: CPV Power Plants, Alstom, Soitec
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SOI Technologies Are Now Mainstream for Manufacturing Switches
Jul 12, 2013At the SEMICON West trade show in San Francisco (9-11 July), Soitec of Bernin, France, which makes engineered substrates - including silicon-on-insulator (SOI) wafers and III-V epiwafers - as well as concentrating photovoltaic (CPV) solar ...
Tags: Electrical, Electronics
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Soitec Has Finalised The ZAR 1,000,000,000 Solar Financing Bond Issued by Ltd
May 3, 2013Soitec of Bernin, France, which makes engineered substrates including silicon-on-insulator (SOI) wafers (as well as III-V epiwafers through its Picogiga International division), has finalised the ZAR 1,000,000,000(more than $100m) solar ...
Tags: Soitec CPV, Soitec
