Improved performance, reduced timing, and form factor motivation were key drivers for adoption of 3D IC and TSV interconnect applications
The global 3D IC market is predicted to grow at a combined annual growth rate (CAGR) of 16.9% from $2.21bn in 2009 to $6.55bn in 2016, according to a report by Markets and Markets.
The research, "Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)" reveals that the companies in this market need to efficiently balance their expenditure between capacity expansion and technology advancement.
This is considered critical since the market for 3D ICs is yet to gain complete recognition and its successful penetration into different end-user segments is largely governed by the R&D initiatives.
The report shows that 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years, mainly due to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
With an accelerated demand for higher bandwidths, reduced power consumption and higher density, it led to gradual migration towards 3D ICs with TSVs as it offers an efficient solution.
Thermal and testing issues and high cost involved largely restrain the growth of the 3D IC and TSV interconnect applications market.
In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by North America with 35%.
Among the various end-products that utilise 3D ICs and TSV interconnects, memories and sensors are expected to provide the largest market due to design upgrades which can be achieved and the growing demand for such designs in several applications.
The report reveals consumer electronics sector largely contributes to the overall growth of the market with respect to the application sectors.
It is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects in the near future.
