SüSS MicroTec AG of Garching, near Munich, Germany, a supplier of equipment and process solutions for microstructuring in semiconductor and related markets, has launched the XB8 bonding platform.
Designed for a wide range of bonding processes, the XB8 wafer bonder supports substrates with a wafer size of up to 200mm. Key process parameters can be adjusted in a wide range, making the system suitable for advanced process development. In a production environment, the high level of automation and reliability of the XB8 ensure a high level of process stability, the firm says.
Typical applications include advanced packaging, MEMS, 3D integration and LED manufacturing. The XB8 wafer bonder offers a broad parameter window and is therefore suitable for carrying out all bonding processes. Bond force up to 100kN is available with a temperature range of up to 550°C. Different substrate shapes and wafer sizes are processed in specifically adapted fixtures. A multi-bond fixture, for example, enables the maximum possible throughput increase by bonding up to eight wafers at once.
"In addition to the high precision and the repeatability of the bonding process from wafer to wafer, a uniform process result across the wafer is essential for achieving a high yield," says Stefan Lutter, general manager of the bonder product lines. "The independent new heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range," he adds. "The innovative mechanical and thermal structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high product quality and yield."
