Samsung Electronics Co Ltd of Seoul, South Korea has introduced a full line-up of chip-scale LED packages (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
Samsung says that its CSP technology reduces the size of a conventional LED package by combining flip-chip technology with phosphor coating technology, eliminating any need for metal wires and plastic molds. This shift enables more flexible and compact designs when manufacturing LED lighting modules or fixtures, and lowers the production and operational costs of LED lighting systems. The firm adds that its CSP products also allow flexibility in adjusting the size of the light-emitting surface and its associated luminance level, to meet the diverse requirements of a wide variety of lighting applications including bulbs, spot lighting, down-lighting and street lighting.
The new CSP line-up has been strengthened with a wide range of operating current options from 0.6W to 3W and even 10W LED packages. The new packages complete Samsung's CSP technology roadmap, which was announced at the LIGHTFAIR International 2015 event when the firm's CSP technology commercialization plan was unveiled.
Mid-power, 0.6W-class CSP LED packages
Based on advanced flip-chip technology, the 149lm/W LM101A and 135lm/W LM102A (Samsung's new mid-power CSP packages for LED lighting) feature ultra-slim form factors and simple package structures aimed to enhance their cost competitiveness. Each offers two voltage options (3V and 6V), making the packages applicable to many applications including bulb, high-bay lighting, down-lighting and spot lighting. The mid-power CSP LED packages also provide wide beam angles, giving greater design flexibility. The LM101A and LM102A packages are available in full-color temperatures with three color rendering index (CRI) options from 70 to 80 and 90. High-power, 3W-class CSP LED package
The LH181A is a high-power CSP package with about 12% higher luminous flux at a maximum current of 1.5A, compared to Samsung's 3W-class ceramic-based high-power LED package. Luminous flux is typically about 162lm/W (at a drive current of 350mA, Ra70, and 5000K). Each LH181A measures 1.91mm x 1.91mm (about 30% smaller than Samsung's ceramic-based LED). The package's ultra-small size enables much smaller lighting designs and better lumens-per-dollar value (especially useful in outdoor and spot lighting applications). A wide beam angle of 140 degrees makes it also applicable to street lighting by adding a lens as a secondary optic solution. CSP arrays
The LH204A and LH309A CSP arrays (for mass production in second-quarter 2016) are high-power LED solutions with an operating wattage range from 5W to 10W. The 124lm/W LH204A is a 2x2 array of CSP LED chips that delivers 12V at a 5W-class operating wattage. The 127lm/W LH309A is a 3x3 chip array offering 26V at a 10W-class operating wattage. Samsung says that the CSP arrays provide high light quality by adhering a single phosphor to the FX (flexible) circuit board on which CSP LED chips with low thermal resistance are arranged. The use of a thin flexible-film FX circuit board accentuates the thin design of the arranged CSP LED chips. The CSP arrays are suitable for spotlighting applications where high light quality is required from a single light source. Phosphor-on-Wafer LED package
Samsung says that its Phosphor-on-Wafer (PoW) LED package technology embraces the advantages of CSP LED packaging while overcoming limitations of cost reduction by upgrading the chip manufacturing process through the use of 8-inch GaN-on-Si wafers instead of 4-inch sapphire wafers. The firm says that this transition will enable a higher-quality CSP LED package by eliminating the chip rearrangement process, because the phosphors can be coated directly on the surface of the GaN-on-Si wafers before being diced whereas sapphire wafers have to be cut into chips first and then rearranged to be coated with phosphor. Samsung has already (several years ago) applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices. The firm also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of 2016.
Samsung is showcasing the new CSP products and technologies solutions in booth B04 (hall 6.2) at the Light + Building 2016 trade fair (under the theme 'Lighting & Beyond) in Frankfurt, Germany (13–18 March).
