Microsanj LLC of Santa Clara, CA, USA - a supplier of high-resolution, thermoreflectance imaging analysis (TIA) c, tools and consulting services - participated in three conferences during Microwave Week in Phoenix, Arizona.
At the 2015 IEEE MTT-S International Microwave Symposium (IMS) in Phoenix (16-22 May), Microsanj demonstrated the NT220B thermoreflectance thermal imaging system with the newly released SanjVIEW 3.0 software package, which offers: enhanced resolution on samples with low reflectivity; full-field and pixel-by-pixel calibration; improved, more powerful image processing algorithms; and user-friendly applications optimized for devices such as gallium nitride (GaN) high-electron-mobility transistors (HEMTs), active load-pull monolithic microwave integrated circuits (MMICs), and nanowires.
"Continued enhancements to the Microsanj thermal imaging systems is essential for ensuring we are offering systems that meet the growing challenges for thermal analysis of devices with shrinking dimensions and increasing complexity," says CEO Dr Mo Shakouri.
At the IEEE Radio Frequency Integrated Circuits Symposium (15-19 May), Microsanj presented the paper 'High Resolution Thermal Characterization of a GaAs MMIC'. Also, on 22 May at the 85th Automatic RF Techniques Group (ARFTG) Microwave Measurement Conference (Measurements and Techniques for 5G Applications), Microsanj presented the paper 'Transient Temperature Measurement of Microwave Devices', providing insight into how thermoreflectance imaging can help to ensure optimal performance and long-term reliability for advanced device designs.
