LED maker Lumileds of San Jose, CA, USA has launched the LUXEON FlipChip White LED, which uses chip-scale packaging (CSP) technology.
After spearheading the adoption of CSP in LEDs, Lumileds has shipped more than 500 million LED emitters to date across several applications. The firm first introduced the LUXEON FlipChip Royal Blue in February 2013, giving luminaire makers design flexibility by starting with the LED die. In early 2015, Lumileds released the LUXEON FlipChip UV, and it has now introduced the LUXEON FlipChip White for the general illumination market.
CSP technology eliminates the traditional submount to minimize package size, which enables manufacturers to attach the LED die directly to the PCB, allowing overall system cost reductions. Lumileds says that its CSP technology is optimized to deliver high efficacy at high current density, achieving what is claimed to be industry-leading lumen density and lm/$ to illumination applications.
Lumileds says that high-lumen applications such as outdoor and industrial lighting benefit from the high-drive-current capabilities and robust high-power architecture of LUXEON FlipChip White LEDs. In addition, the small source size and high lumen density of LUXEON FlipChip White enables high packing density and superior beam control for directional lamps and luminaires, the firm adds. LUXEON FlipChip White is offered in two package sizes (1.4mm x 1.4mm and 1.1mm x 1.1mm) and a range of CCTs (correlated color temperatures) across CRIs (color rendering indexes) of 70 and 80.
Lumileds says that it aims to further accelerates industry's adoption of CSP technology by offering LUXEON FlipChip White on its Matrix Platform. These LED boards, linear flex and modules can come configured with LUXEON FlipChip White along with connectors, optics, wiring and/or electronics, improving time-to-market and simplifying the supply chain, the firm claims.
