Brewer Science Inc of Rolla, MO, USA, which provides thin-wafer-handling materials, processes and equipment, has unveiled the Apogee bonder for temporary wafer bonding applications. The firm says that this marks a milestone in leveraging its unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.
The Apogee bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The new system completes Brewer Science's thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices. The firm says that this collection of tools provides reduced time to market for ultrathin wafer technologies using Brewer Science's integrated material and process solutions.
Delivering high accuracy, interface capabilities, and process flexibility, the Apogee bonder's features include the following:
a substrate size range of 50-300mm; dual rigid platens that heat the wafer stack from both sides, minimizing thermal defects; ultraflat self-leveling platens that minimize total thickness variation (TTV); Evacuated bond chamber eliminates voids; separation of carrier and device during pre-bond evacuation; a total thickness variation of <10%; and real-time access and control to process data and push notifications.
Brewer Science says that its processing equipment allows users to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes the tool suite suitable for low-volume production or R&D lab environments.
Technology strategist Justin Furse is presenting 'Thin Wafer Bonding/Debonding in Low-Volume Compound Semiconductor Production' on 20 May at the Exhibitor Forum of the 2014 International Conference on Compound Semiconductor Manufacturing Technology (CS ManTech) in Denver (19-22 May). The firm is also exhibiting in booth #33.
