In booth 1136 at the Optical Fiber Communication Conference & Exposition/National Fiber Optic Engineers Conference (OFC/NFOEC 2013) at the Anaheim Convention Center, California (17–21 March), micro/nanotechnology R&D center CEA-Leti of Grenoble, France is presenting its capabilities for silicon photonics components and device prototyping, and providing updates of its recent work on laser integration and packaging of silicon photonics dies, including fiber-to-die interconnects.
Leti is a founding member of the large Grenoble-based PLAT4M (Photonic Libraries And Technology for Manufacturing) initiative to establish a technology platform specializing in silicon photonics.
To address all the key challenges of this field and to accelerate the technology’s adoption in the telecoms and datacoms sectors, the initiative is focusing on:
establishing prototyping and manufacturing capabilities on 200mm and 300mm wafers; designing and testing silicon photonic components and links; developing passive and active silicon components on silicon-on-insulator (SOI) substrates; exploring new solutions for integrated photo-detectors and integrated emitter technologies, including indium phosphide (InP) lasers and vertical-cavity surface-emitting lasers (VCSELs); and exploring packaging solutions for the integration of CMOS electronics with SOI photonic integrated circuits (PICs) and for the low-cost connection of dies to fibers.
