A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate, an insulation substrate, a second electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate, a third electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate.
Also, includes plurality of DC link capacitors connected in parallel to each of the first electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate and the second electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate; a plurality of first Y-capacitors connected in series to each of the first electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate and the third electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate and the third electrodeA solid electric conductor through which an electric current enters or leaves in a medium substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.
