Brewer Science Inc of Rolla, MO, USA, which provides thin-wafer-handling materials, processes and equipment, has announced the first commercial placement of its Cee 1300CSX thermal slide debonder. The debonder was purchased by "an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications".
The Cee 1300CSX enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates - including gallium arsenide (GaAs), gallium nitride (GaN), indium phosphide (InP) and silicon carbide (SiC) - from a rigid carrier to allow further processing of delicate thinned wafers. This debonding can be accomplished in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.
"This commercial launch marks another strategic milestone in reducing the customer's cost of ownership for thin-wafer handling through Brewer Science's industry-leading equipment, temporary bonding materials, and process integration," says equipment technology strategist Justin Furse.
In a compact footprint, the tool has precise lower platen z-position control and programmable electronic lift pins for loading and unloading. and substrate sizes can be varied. The Cee 1300 CSX also has a constant force mode, excess force sensing and data logging.
Brewer Science claims that the Cee 1300CSX delivers exceptional accuracy, interface capabilities and process flexibility, and enables precise control of the process temperature for thermally sensitive substrate materials, allowing users to accelerate time to market of their new ultrathin wafer technologies.
Improvements engineered into the new Cee 1300CSX debonder design include: precise lower platen z-position control; programmable electronic lift pins for loading and unloading; a compact footprint; flexible substrate sizes; a constant force mode; data logging and excess force sensing.
