Trade Resources Industry Views Philip Ssl Craford Pointed out That LED Packaging Component Prices

Philip Ssl Craford Pointed out That LED Packaging Component Prices

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.

Luminosity for cool white and warm white lights in 2013 have reached 164lm/W and 129lm/W respectively. Philip’s goal for 2020 is for cool and warm lights to both reach a luminosity of 266lm/W. It is predicted that by 2020, the company will reach their 2000lm/dollar target. 

 LED technology progression and price have become the driving force behind the lighting market. During SEMICON, Mr.Craford mentioned that 1m/W and 1m/dollar are expected to continue increasing over the next 10 years. The current luminosity for packaging components for 2013 has already reached 164lm/W and 129lm/W for cool and warm white lights. Philips predicts that by 2020, the luminosity will reach 235lm/W and 224lm/W respectively, though the company’s target is for each to reach 266lm/W.

 LED price/performance ratio continues to increase. According to resources provided by Mr. Craford in regards to cool white light, there will be 250 lumens to every US$1 in 2013. Warm white lights will be about 196 lumens to 1m/dollar. It is estimated that by 2020 cool white lights and warm white lights will both reach 1428lm/dollar. Philip’s target for 2020 is 2000lm/dollar.

Aside from having a secure standing in the global high-powered market and mid-powered product line, Mr. Craford also brought up during SEMICON that Philips excells in mid-powered packaging. Philips mid power LED package method has evolved from using PLCC packaging with PPA lead frames to using QFN package methods with PCT lead frames. QFN package methods that use EMC and SMC lead frames have also been on the rise in recent years. Mr. Craford believes that using EMC and SMC lead frames will evolve towards ceramic flip chip packaging methods.

Mr. Craford pointed out that mid-powered packaging technology is heading towards improving product life span, heat dissipation performance, and increase electrical currents, efficiency, and production performance efficiency. Mid-power LED light source product technology continual improvements open up lighting and backlighting applied market.

Source: http://www.ledinside.com/news/2013/9/philips_discusses_future_developments_in_packaging
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Philips Discusses Future Developments in Packaging
Topics: Lighting