A new report estimates that the compound annual growth rate (CAGR) of polymer usage will increase by 26% in wafer level applications over the next 5 years. Last year, polymeric semiconductor material market was valued at $274 million, according to market research company Yole Développement. Future growth will be fueled by the expansion of flip-chip wafer bumping, fan-in wafer level chip scale packages (WLCSP), 3-D wafer level packages (WLP), fan-out wafer level packages (FO WLP), 2.5-D glass/silicon interposers and 3-D integrated circuit (3DIC) packages.
The report, “Polymeric Materials for 3DIC & WLP Applications, ” provides an analysis of the opportunities for polymeric materials in 3DIC and wafer-level packaging applications.
The report finds that an increasing number of polymers are being used for WLP applications. “About half of the demand today for polymeric materials in 3DIC and WLP applications is driven by dielectric passivation resins, which reached about $107 million market value in 2011, ” stated Phil Garrou, senior consultant, advanced packaging at Yole Développement.
Polymide (PI) and BCB of Dow Chemical continue to account for greater than 70% of the total demand, historically by the growth of flip-chip bumping and WLCSP passivation steps. PBO, epoxies, WPR and AL-X recently entered the market due to growing demand in 300 mm WLCSP, FO WLP and emerging 3DIC applications.
