GaAs-based broadband wireless and wireline communications component maker Anadigics Inc of Warren, NJ, USA has launched a new family of 802.11ac power amplifiers (PAs) optimized for WiFi infrastructure and multimedia applications, including access points, routers, media gateways, set-top boxes, and smart TVs.
The power amplifiers deliver a combination of high gain and output power (to ensure optimal performance in infrastructure and multimedia applications) as well as high linearity, to maximize data throughput and ensure reliable transmission of high-definition (HD) video at extended ranges. Ultra-low error vector magnitude (EVM) in the toughest 802.11ac modulation formats also enables extremely high transmission data rates. The new 802.11ac solutions also feature greater integration compared with a typical power amplifier, reducing external component requirements and saving valuable PCB space.
Acting as “critical enablers” in the expanding use of 802.11ac MIMO technology for WiFi infrastructure in both commercial and residential applications, the firm’s latest power amplifiers “complement and build upon the success of our highly integrated front-end ICs by offering exceptional gain, output power and linearity to deliver higher data rates at greater ranges for an enhanced computing and multimedia user experience,” says Dave Cresci, VP of WiFi Products.
Anadigics’ new family of WiFi power amplifiers leverage the firm’s exclusive InGaP-Plus technology and patented design architectures to offer high performance and integration.
The first product in the family is the AWL5905 power amplifier, which offers 29dB of gain and is optimized for 5GHz WLAN standards, including 802.11a/n/ac. The AWL5905 has an integrated power detector that facilitates accurate power control over varying load conditions (3:1 VSWR), as well as a CMOS-compatible digital PA enable interface that improves ease of use and eliminates the requirement for an external buffer amplifier. This level of integration includes internal RF matching and is provided in a compact, low-profile 4mm x 4mm x 0.8mm QFN surface-mount package with RF ports internally matched to 50 Ohms and DC blocked to reduce PCB space requirements.
The AWL5905 also combines high power efficiency and improved thermal performance, enabling manufacturers to develop multiple-input multiple-output (MIMO) solutions that consume less power and are more thermally efficient.
Engineering samples of the AWL5905 are available now for qualified programs.
