An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other.
Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrodeA solid electric conductor through which an electric current enters or leaves in a medium and a second external connection electrodeA solid electric conductor through which an electric current enters or leaves in a medium that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.
