At the SEMI Industry Strategy Symposium Europe 2016 conference in Nice, France (6–8 March), Paul Lindner, executive technology director at EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications), received the 2015 European SEMI Award.
Established in 1989, the European SEMI Award recognizes individuals and teams that have made a significant contribution to the European semiconductor and related industries.
Paul Lindner was nominated and selected by his peers within the international semiconductor community in recognition of his outstanding contributions in the field of wafer processing equipment. Lindner is honoured for leading exceptional innovations in wafer bonding technologies at EVG. The process separation between wafer alignment and wafer bonding (developed in 1990) revolutionized wafer bonding technology and has since become an industry standard. Lindner is said to have changed the way the industry builds semiconductors, exemplifying EVG's ongoing effort of "being the first" in exploring new techniques and serving next-generation applications of micro- and nano-fabrication technologies, the citation adds.
"We are very proud of SEMI Member EVG's achievements in wafer bonding technologies and the contributions that Paul Lindner and his team have made to the semiconductor community," commented SEMI Europe president Laith Altimime.
Lindner heads the R&D, product and project management, quality management, business development and process technology departments at EVG. He joined the firm in 1988 as a mechanical design engineer and has since pioneered semiconductor and MEMS processing systems, which have set industry standards.
