Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.
“Samsung proudly presents its new 13, 26, and 40W, 129 lm/W high performance COB package family, based on our world class chip and phosphor technology,” said Jaap Schlejen, senior vice president, LED lighting sales and marketing, Samsung Electronics. “The new COB family, is designed to meet Zhaga specifications, and has a low thermal resistance and superior heat dissipation for high reliability.”
The series - LC013/26/40B, features a 129lm/W light efficacy at 80 CRI (Color Rendering Index) and 5000K CCT (Correlated Color Temperature) and is available in 2700K, 3000K and 4000K versions. By adopting chip-on-board technology that utilizes metal core PCBs, the new COB family offers outstanding color uniformity and light quality, while achieving a high luminous flux of up to 6000lm in a single LED package.
The Samsung COB family will be available in May. Further additions to Samsung’s COB package lineup will be made later this year, to offer even more options for customers.
The Samsung’s COB family will be displayed at LIGHTFAIR International 2013 (Booth #2645), along with other LED packages, as well as new LED engines, lamps and L-Tubes. LIGHTFAIR International will be held at the Pennsylvania Convention Center in Philadelphia from April 23rd-25th.
