More than a quarter of the world's wafer capacity is for processes better than 40nm, says IC Insights.
At the end of 2012, about 27% of global wafer capacity was for devices having geometries smaller than 40nm. Such devices include high-density DRAM, which are typically built using 30nm- to 20nm-class process technologies; high-density flash memory devices that are based on 20nm- to 10nm-class processes; and high-performance microprocessors and advanced ASIC/ASSP/FPGA devices based on 32/28nm or 22nm technologies.
Source:
http://www.electronicsweekly.com/Articles/2013/04/06/55882/25-of-capacity-is-better-than-40nm-says-ic-insights.htm
