In booth 360 at the European Conference on Optical Communications (ECOC 2013) in London, UK (23-25 September), the Optical Internetworking Forum is hosting a record number of multi-vendor interoperability demonstrations.
Addressing a wide range of technologies supporting 100G and 400G architectures, 11 firms are verifying the interoperability of their products in nine separate demonstrations illustrating the feasibility of building and implementing next-generation 100G and 400G capabilities into products today.
‘OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures’ addresses a variety of OIF-supported technologies including CEI-28G-VSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25G-LR backplane applications, module thermal specifications, and SerDes interconnect solutions.
“The OIF has defined a robust 25G channel technology that the industry is now adopting for 25G, 50G, 100G and400G applications,” says OIF Physical and Link Layer Interoperability Working Group chair Ed Frlan of Semtech Corp in Camarillo, CA, USA (which supplies analog and mixed-signal semiconductors for high-end consumer, computing, communications and industrial equipment). “By showing that the technology interoperates with multiple vendors in hardwarethat is available today, the industry can now leverage the investments made in 25G technology for future 100G and 400G applications,” he adds.
The following firms are participating in OIF Interoperability 2013: Amphenol, Applied Micro, Cisco, Finisar, Fujitsu Optical Components, Inphi, Molex, MoSys, Semtech, TE Connectivity, and Xilinx. Technologies demonstrated during the testing includes host ICs with VSR SerDes capability, host PCB traces, optical module connectors, high-speed electrical I/O and backplane connectors, module retimers, heat sinks and optical transceivers all operating with 28G electrical interfaces. Agilent Technologies Inc and Tektronix Inc are supplying test equipment used in the demonstration.
OIF leadership speaking at ECOC
OIF leadership has been invited to speak to ECOC attendees on OIF activities and work efforts. Both presentations will take place in the Market Focus Theater on the show floor:
‘Evolution of System Electrical Interfaces Towards 400G Transport’ (23 September, 1.55–2.25pm) – Semtech’s Ed Frlan (OIF PLL Interoperability Working Group chair) and TE Connectivity’s Nathan Tracy (OIF Technical Committee vice chair); ‘Requirements and Technologies for Transport SDN’ (24 September, 1.15–1.45pm) – Verizon’s Vishnu Shukla (OIF president) and Deutsche Telekom’s Hans-Martin Foisel (OIF Carrier Working Group chair and board member).
