Toshiba is offering European ASIC customers a flexible process development and foundry manufacturing service built around its 8"(200mm)CMOS wafer fabrication capabilities.
The service combines support for special processes,process modifications and bespoke process development with cost-effective medium-and high-volume manufacturing that is backed by a commitment to long-term supply.
Toshiba's service is for customers developing special applications including sensors,detectors and other analogue functions and for companies looking to migrate existing applications to commercially attractive CMOS-based technology.
Currently available process nodes comprise 0.6μm,0.35μm,0.18μm,0.13μm,110nm and 90nm.Standard IP options range from logic and embedded memory(SRAM,ROM,EEPROM and Flash EEPROM)to CMOS sensors with a variety of pixel sizes.High-voltage CMOS and DMOS processes are available for designs demanding higher power operation.
Working with Toshiba development teams,customers have the flexibility to define a range of options,devices,design rules and modules.These include special wafer substrates,custom-specific process modules,special implant-and diffusion process conditions and custom layer stacks.Toshiba is also offering non-standard post-processing steps such as'through-silicon-vias',protection films,optical films and micro-lenses.
The flexible process foundry service also covers wafer probing and light/dark testing in Toshiba's fab in Iwate,Japan.
