H.B. Fuller Company has been awarded a patent for a hot melt adhesive composition comprised of a thermoplastic polymer comprised of ethylene copolymer selected from the group consisting of ethylene vinyl acetate, ethylene n-butyl acrylate, ethylene methyl-methacrylate, ethylene ethyl methacrylate, ethylene 2-ethylhexyl acrylate, ethylene methacrylate, ethylene ethylacrylate and ethylene acrylic acid; a first tackifying agent comprised of phenol-modified aromatic petroleum hydrocarbon resin; and a first wax, wherein the composition is free of a vegetable wax and exhibits a viscosity of no greater than approximatley 6,000 centipoise at 300° F.
Source:
http://www.coatingsworld.com/issues/0713/view_patents/hb-fuller-patents-low-application-temperature-hot-melt-adhesive/
