In hall B2, booth 350 at the Laser World of Photonics 2017 trade show in Munich, Germany (26–29 June), Berlin-based Ferdinand-Braun-Institut, Leibniz-Institut für Hochstfrequenztechnik (FBH) – which offers the full value ...
Tags: FBH, UV LED Developments
MACOM Technology Solutions Holdings Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has unveiled a development kit targeted at helping ...
Tags: RF Systems, power transistors
Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA (which makes laser components and subsystems) says that its DirectProcess 900 direct-diode laser engine is now available with 600W continuous output ...
South Korea's Samsung Electronics Co Ltd has begun mass producing a new mid-power LED package, the LM301B (with samples available now), featuring what is claimed to be the industry’s highest luminous efficacy of 220 lumens per watt. ...
Romaco, a Germany-based packing and process technology manufacturer, has demonstrated 15 of its machines at the recently held Interpack 2017. The company exhibited the machines to industry professionals and to its new owner, the Chinese ...
Tags: Romaco, Interpack 2017
In booth #1042 at the IEEE MTT International Microwave Symposium (IMS 2017) in Honolulu, Hawaii (6-8 June), Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based ...
A new report from Smithers Pira has revealed that digital print for packaging market will surge to $23.2bn in 2022, from $13.2bn in 2017. The report titled ‘The Future of Digital Print for Packaging to 2022’ explores how the ...
Tags: Packaging Market, Digital Print
Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has announced new bulk acoustic wave (BAW) filters that significantly expand Wi-Fi range and coverage ...
Tags: Qorvo BAW filter, Filter
Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs. The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping ...
Tags: Siemens, Packaging Flow
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA, which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications, has announced the EPC2111, a 30V ...
Tags: transistors, GaN transistor
Health and hygiene company RayVio Corp of Haywood, CA, USA, which is commercializing deep-ultraviolet (UV) LEDs and consumer disinfection solutions, has published its latest application note, which details its UV dosing experiments proving ...
Wide-format printers provider Roland DGA has unveiled a new software for its Texart Dye-Sublimation inkjet printers. The ErgoSoft Roland Edition 2 RIP software has been developed by ErgoSoft exclusively for Roland’s Texart RT-640 ...
The Valspar has expanded production capacity of its automotive refinish coatings products at US-based manufacturing facilities. Recent technology and equipment upgrades at locations in Garland, Texas and Pittsburgh, Pennsylvania have ...
Tags: Valspar, Refinish Coatings
Analog Devices Inc (ADI) of Norwood, MA, USA has launched small-form-factor isolated gate drivers designed for the higher switching speeds and system size constraints required by power switch technologies such as silicon carbide (SiC) and ...
Tags: Analog Devices, GaN Power
LED maker Lumileds of San Jose, CA, USA has added the LUXEON 2835E 3V to its LUXEON 2835 Line. The standard 2.8mm x 3.5mm package footprint first gained traction in television backlighting, but it is now proving convenient in general ...