kbb Birmingham was a resounding success kbb Birmingham 2016, held from March 6 to 9, was the biggest and busiest show yet. The four days featured over 35% more exhibitors than 2014, all of which demonstrated a high calibre of product ...
NeoPhotonics Corp of San Jose, CA, USA (a vertically integrated designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for high-speed communications networks) has announced initial sample availability ...
Tags: NeoPhotonics, PICs
Nanoelec Research Technological Institute (IRT) in Grenoble, France - an R&D consortium headed by CEA-Leti focused on information and communication technologies (ICT) using micro- and nanoelectronics - has announced the first co-integration ...
Tags: III-Vs-on-Si, Direct wafer bonding
In booth 2709 at Optical Fiber Communication Conference and Exposition (OFC 2016) in Anaheim, CA, USA (22-24 March), optical communication product maker Source Photonics Inc of West Hills, CA, USA is demonstrating a 2x50G-PAM4 QSFP28 100G ...
Tags: Source Photonics, QSFP28
Pipetech International developed the system to address the need for pipeline operators to detect and record transient pressure events occurring in water, wastewater and petroleum pipelines. The system, which was introduced in 2005, ...
Tags: Pipeline operators, Pipetech International, Monitoring technology
OpSec Security has started negotiations to acquire the security business of API Holographics, which primarily serves the UK market. API Group plans to complete the divestment process by April, after consulting with the employees, ...
Tags: OpSec, Aquisition, API Holographics, API Group
Macfarlane Packaging, a UK-based distributor of protective packaging materials, has launched the new packaging innovation lab in order to help create bespoke, cost effective protective packaging solutions for customers. Located in ...
Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...
Leading global printing trade fair drupa prepares for launch under its Touch the Future theme, and packaging is a key focus. From 31 May to 10 June the who's who of the printing industry will gather in Dusseldorf to discover the next ...
Tags: Drupa, Touch the Future, Packaging, Print 4.0
Trends in consumer engagement will lead to the rapid rise of smart packaging solutions as costs become more manageable for brand owners. A new report by packaging industry researcher Smithers Pira predicts the global smart (active and ...
Tags: Smart packaging, Technology, Smithers Pira
Tokyo-based Mitsubishi Electric Corp says that on 1 July it will start shipping a laser-diode transmitter optical subassembly (TOSA) capable of supporting 100Gbps optical transmissions. The new FU-402REA is being displayed at the Optical ...
Tags: Mitsubishi Electric, EML TOSA
M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has announced the availability of volume shipments of its ...
GigOptix Inc of San Jose, CA, USA (a fabless supplier of analog semiconductor and optical communications components for fiber-optic and wireless networks) has signed global technology distributor Avnet Inc as distributor for all its product ...
Tags: GigOptix, Avnet, Distribution
GE Aviation (an operating unit of GE) has been awarded a $2.1m contract from the US Army to develop and demonstrate silicon carbide (SiC)-based power electronics supporting high-voltage next-generation ground vehicle electrical power ...
Tags: GE Aviation, SiC power devices
UK-based Cobham plc (which designs and manufactures equipment, specialized systems and components for the aerospace, defense, energy and electronics industries) has established a strategic partnership to incorporate the gallium nitride ...