Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its ...
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, and manufacturer of chemicals for the electronics industry Dynaloy LLC (a wholly owned subsidiary of Eastman Chemical Company) have introduced ...
Tags: lithography equipment, Electrical, Electronics, compound semiconductor
Plasma etch, deposition and thermal processing equipment maker SPTS Technologies Ltd of Newport, Wales, UK (a Bridgepoint portfolio company) has reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. Fundamental ...
Tags: SPTS, Electronics
Back-end segment and the wafer-level packaging (WLP)-related segments ruled the semiconductor market during the year Global semiconductor capex on manufacturing equipment declined 16.1% during 2012 to $37.8bn compared to 2011, according ...
The Chinese government views the growth of the LED industry as a national security matter. As a result, it is driving a vast LED manufacturing effort and offering subsidies from central and local government agencies to help build its own ...
Tags: LED Industry, LED
The same material that formed the first primitive transistors more than 60 years ago can be modified in a new way to advance future electronics, according to a new study. Chemists at Ohio State University have developed the technology for ...
Plasma etch, deposition and thermal processing equipment maker SPTS Technologies Ltd of Newport, Wales, UK says it has received multiple orders from several European research and development (R&D) institutions, including the Delft Institute ...
Tags: SPTS Etch SiC, Electrical, Electronics, thermal processing equipment
GlobalFoundries has showcased a new technology that allows 3D stacking of chips for use in mobile and consumer applications. The company uses the 20nm-LPM process technology to manufacture its first functional 20nm silicon wafers with ...
Tags: mobile, applications, chips
Globalfoundries claims a breakthrough in 3D stacking of chips with the demonstration of functional 20nm silicon wafers with integrated through-silicon vias. The technique allows chips to be stacked on top of each other with circuit ...
Tags: Consumer Electronics, Electronics, Chip
At the SEMICON China show in Shanghai next week (19-21 March), Shanghai-based dielectric and through-silicon via (TSV) etch tool supplier Advanced Micro-Fabrication Equipment Inc (AMEC) is making its solid-state lighting (SSL) market debut ...
Tags: MOCVD, Electrical, Electronics
Specialty foundry TowerJazz (which has fabrication plants at Tower Semiconductor Ltd in Migdal Haemek, Israel, and at its subsidiaries Jazz Semiconductor Inc in Newport Beach, CA, USA and TowerJazz Japan Ltd) has announced significant ...
Tags: TowerJazz, Tower Semiconductor, Front-End Module Market
Hybrid Memory Cube (HMC) technology is poised to take a bow in the high-performance computing space as a potential answer to the problem of one of the main bottlenecks in computing - the poor relative-performance of memory. After that, the ...
Tags: Hybrid Memory Cube, computing space, mainstream computing
Imec and PVA Tepla claim a breakthrough in the detection of through-silicon via (TSV) voids in 3D stacked IC technology. They used GHz scanning acoustic microscopy (SAM) technology to detect TSV voids at wafer-level after TSV Copper ...
Tags: Imec, PVA Tepla, through silicon, 3D stacked IC technology
Improved performance, reduced timing, and form factor motivation were key drivers for adoption of 3D IC and TSV interconnect applications The global 3D IC market is predicted to grow at a combined annual growth rate (CAGR) of 16.9% from ...
Tags: key drivers, adoption, improved performance, reduced timing, form factor
The release of GAN-on-silicon LED chips in China presents a lower-cost alternative that is comparable in quality to mainstream products based on sapphire and SiC substrates. R&D work leveraging the advantages of silicon substrates has ...
Tags: led chip