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Kulicke & Soffa Acquires Dutch Packaging Company Liteq

Jul 12, 2017

Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...

Tags: Semiconductor packaging, packaging

Berkeley Lab-LED Team Fabricates Transistor with Record 1nm-Long Gate

Oct 12, 2016

A research team led by faculty scientist Ali Javey at the US Department of Energy's Lawrence Berkeley National Laboratory (Berkeley Lab) has created a transistor with a gate length (the defining dimension of a transistor) just 1nm long, ...

Tags: Berkeley Lab, transistor with record 1nm-long gate

GlobalFoundries Broadens SiGe PA Portfolio, Enhancing RF Performance And Efficiency For Wireless Devices

Mar 22, 2016

GlobalFoundries of Santa Clara, CA, USA (one of the world's largest semiconductor foundries, with more than 250 customers and operations in Singapore, Germany and the USA) has announced new radio-frequency silicon solutions, further ...

Tags: Wireless Devices, semiconductor

Veeco Wins Advanced Packaging System Orders From Asian Foundry

Dec 25, 2015

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system (a platform that provides ...

Tags: Veeco Wet processing, Veeco Instruments Inc, Electronics

Veeco Wins Multiple Advanced Packaging System Orders in Asia

Dec 25, 2015

Veeco Instruments has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. ...

Tags: Veeco Instruments, Fan-out Wafer Level Packaging, Packaging

Ultratech Receives Large Multiple System Order for Fan-out Wafer-Level Packaging Application

Oct 21, 2015

Ultratech, a supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has ...

Tags: Wafer-Level Packaging, LEDs

Intel Hopes to Take Hardware Performance to The Next Level with Xeon Phi Chip

Jul 7, 2014

Intel hopes to take hardware performance to the next level with its latest Xeon Phi supercomputing chip, which packs an array of new hardware technologies that could eventually find their way to laptops and desktops. The new Xeon Phi ...

Tags: Intel, Chip

Yole Développement Has Released a New Study 'permanent Wafer Bonding for Semiconductor

Apr 24, 2014

With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...

Tags: Electrical, Electronics

Altatech Has Received an Order for Its Orion LedMax Wafer Inspection and Metrology System

Apr 16, 2014

Altatech of Montbonnot, near Grenoble, France (a subsidiary of Soitec since January 2012) has received an order for its Orion LedMax wafer inspection and metrology system from Osram Opto Semiconductors GmbH of Regensburg, Germany. Osram ...

Tags: LED Maker, Osram

Altatech Semiconductor S.A. Received an Order From The University of Washington in Seattle

Apr 3, 2014

Altatech Semiconductor S.A. of Montbonnot, near Grenoble, France (a subsidiary of Soitec since January 2012) has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system, whose ...

Tags: CVD System, Process Materials

Keeping Engineers Can Only Benefit The Makers of Antacids

Feb 26, 2014

While everyone loves a good mystery, keeping engineers guessing as to which breakthroughs will shape future electronic component design can only benefit the makers of antacids. And while it’s hard to predict that a given research ...

Tags: RF Circuits, Graphene-Based

The Discovery of What Is Essentially a 3D Version of Graphene

Jan 16, 2014

The discovery of what is essentially a 3D version of graphene – the 2D sheets of carbon through which electrons race at many times the speed at which they move through silicon - promises exciting new things to come for the high-tech ...

Tags: Consumer Electronics, Electronics

Engineers at Imec and IBM Have Independently Developed New Manufacturing Processes

Dec 23, 2013

Engineers at Imec and IBM have independently developed new manufacturing processes for making the next decade's leading chips, they revealed late last year. These efforts will allow the marriage of silicon wafers and certain exotic ...

Tags: Electrical, Electronics

Intel Is Looking to Use Light and Lasers to Shuffle Data Faster Among Servers

Aug 16, 2013

Intel is looking to use light and lasers to shuffle data faster among servers, and is proposing a new optical interconnect, MXC, that could change the way servers are implemented in data centres. The chip maker is pitching MXC as a ...

Tags: Intel, Data Transfers

China Has Been Granted Validated End-User (VEU) Status by The US Department

Aug 9, 2013

Advanced Micro-Fabrication Equipment Inc (AMEC) of Shanghai, China has been granted Validated End-User (VEU) status by the US Department of Commerce. AMEC makes dielectric and through-silicon via (TSV) etch systems, and at March's SEMICON ...

Tags: MOCVD, Electrical, Electronics

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