Improved performance, reduced timing, and form factor motivation were key drivers for adoption of 3D IC and TSV interconnect applications The global 3D IC market is predicted to grow at a combined annual growth rate (CAGR) of 16.9% from ...
Tags: key drivers, adoption, improved performance, reduced timing, form factor
Cadence is working with foundry TSMC on a tool chain and process for 3D chip designs. 3D chip design incorporates multi-chip packages and even multi-die devices with through silicon via(TSV)interconnect technologies.This requires that the ...
Tags: TSMC and Cadence, 3D Chips, intellectual property, through silicon via