- Location
through silicon via
"-
Kulicke & Soffa Acquires Dutch Packaging Company Liteq
Jul 12, 2017Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...
Tags: Semiconductor packaging, packaging
-
GlobalFoundries Broadens SiGe PA Portfolio, Enhancing RF Performance And Efficiency For Wireless Devices
Mar 22, 2016GlobalFoundries of Santa Clara, CA, USA (one of the world's largest semiconductor foundries, with more than 250 customers and operations in Singapore, Germany and the USA) has announced new radio-frequency silicon solutions, further ...
Tags: Wireless Devices, semiconductor
-
Veeco Wins Advanced Packaging System Orders From Asian Foundry
Dec 25, 2015Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system (a platform that provides ...
Tags: Veeco Wet processing, Veeco Instruments Inc, Electronics
-
Veeco Wins Multiple Advanced Packaging System Orders in Asia
Dec 25, 2015Veeco Instruments has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. ...
Tags: Veeco Instruments, Fan-out Wafer Level Packaging, Packaging
-
Ultratech Receives Large Multiple System Order for Fan-out Wafer-Level Packaging Application
Oct 21, 2015Ultratech, a supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has ...
Tags: Wafer-Level Packaging, LEDs
-
Intel Hopes to Take Hardware Performance to The Next Level with Xeon Phi Chip
Jul 7, 2014Intel hopes to take hardware performance to the next level with its latest Xeon Phi supercomputing chip, which packs an array of new hardware technologies that could eventually find their way to laptops and desktops. The new Xeon Phi ...
-
Altatech Has Received an Order for Its Orion LedMax Wafer Inspection and Metrology System
Apr 16, 2014Altatech of Montbonnot, near Grenoble, France (a subsidiary of Soitec since January 2012) has received an order for its Orion LedMax wafer inspection and metrology system from Osram Opto Semiconductors GmbH of Regensburg, Germany. Osram ...
-
Altatech Semiconductor S.A. Received an Order From The University of Washington in Seattle
Apr 3, 2014Altatech Semiconductor S.A. of Montbonnot, near Grenoble, France (a subsidiary of Soitec since January 2012) has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system, whose ...
Tags: CVD System, Process Materials
-
China Has Been Granted Validated End-User (VEU) Status by The US Department
Aug 9, 2013Advanced Micro-Fabrication Equipment Inc (AMEC) of Shanghai, China has been granted Validated End-User (VEU) status by the US Department of Commerce. AMEC makes dielectric and through-silicon via (TSV) etch systems, and at March's SEMICON ...
Tags: MOCVD, Electrical, Electronics
-
Rudolph Technologies Today Released Three New Application-Specific Configurations
Jul 26, 2013Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its ...
-
SPTS Has Reached a Milestone in Shipping Its 1000th Deep Reactive Ion Etch (DRIE) Module
May 9, 2013Plasma etch, deposition and thermal processing equipment maker SPTS Technologies Ltd of Newport, Wales, UK (a Bridgepoint portfolio company) has reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. Fundamental ...
Tags: SPTS, Electronics
-
The Chinese Government Views The Growth of The LED Industry as a National Security Matter
Apr 18, 2013The Chinese government views the growth of the LED industry as a national security matter. As a result, it is driving a vast LED manufacturing effort and offering subsidies from central and local government agencies to help build its own ...
Tags: LED Industry, LED
-
AMEC Reckons That Solid-State Lighting Is a Natural Market Move for It
Mar 14, 2013At the SEMICON China show in Shanghai next week (19-21 March), Shanghai-based dielectric and through-silicon via (TSV) etch tool supplier Advanced Micro-Fabrication Equipment Inc (AMEC) is making its solid-state lighting (SSL) market debut ...
Tags: MOCVD, Electrical, Electronics
-
Towerjazz Has Announced Significant Customer Engagements Gain in The FEM
Mar 13, 2013Specialty foundry TowerJazz (which has fabrication plants at Tower Semiconductor Ltd in Migdal Haemek, Israel, and at its subsidiaries Jazz Semiconductor Inc in Newport Beach, CA, USA and TowerJazz Japan Ltd) has announced significant ...
Tags: TowerJazz, Tower Semiconductor, Front-End Module Market
-
Imec and PVA Tepla Claim a Breakthrough in The Detection of TSV Void in 3D
Jan 18, 2013Imec and PVA Tepla claim a breakthrough in the detection of through-silicon via (TSV) voids in 3D stacked IC technology. They used GHz scanning acoustic microscopy (SAM) technology to detect TSV voids at wafer-level after TSV Copper ...
Tags: Imec, PVA Tepla, through silicon, 3D stacked IC technology