Chadwicks, a Clondalkin Group company, is set to design new pre-cut lids for the UK-based dairy firm Stapleton's complete yoghurt products range. The latest decision is said to be Stapleton's move to manage its changeover from aluminum ...
Tags: Chadwicks, Stapleton's complete, Packaging
Ingenium, the new family of premium diesel and petrol engines designed, engineered and manufactured by Jaguar Land Rover, delivers class-leading levels of torque, horsepower and refinement while reducing emissions and fuel consumption. ...
Tags: Ingenium, Jaguar Land Rover, Auto Parts
Shenzhen BYD Daimler New Technology, a joint venture between Daimler and BYD, has unveiled its new all-electric vehicle, DENZA, at the Auto China 2014, which is being held at Beijing in China. The vehicle is equipped with an 86kW ...
Tags: BYD, DENZA, Auto Parts
Jaguar will unveil the latest addition to its sports saloon car family, the Jaguar XE, at a star-studded event in London on September 8th. The event will mark the unveiling of a true driver's car; one that redefines the concept of the ...
Tags: Jaguar, Jaguar XE, Auto Parts
The S 65 AMG Coupé is the new twelve-cylinder top-of-the-range model in the S-Class Coupé series. Unique drive comfort, benchmark performance and exquisite appointments are all hallmarks of this two-door vehicle. The ...
Tags: AMG Coupe, S-Class, Auto Parts
Epistar Corp (Taiwan’s largest manufacturer of LED epiwafers and chips) is to issue 174.612 million new shares (worth NT$10 each, totalling NT$1746.12m) to acquire fellow Taiwanese LED epiwafer and chip maker Formosa Epitaxy Inc ...
Tags: LED epiwafers, LED chips
Turkey's Bilkent University has used hollow-cathode plasma-assisted atomic layer deposition (HCPA-ALD) to make gallium nitride (GaN) thin-film transistors (TFTs) at temperatures below 250°C [S. Bolat et al, Appl. Phys. Lett., vol104, ...
Tags: HCPA-ALD GaN Thin-film transistors, Electrical, Electronics, Transistors
Researchers in Taiwan claim to be the first to use bumping technology to create piezoelectric-induced performance enhancement in flip-chip packaged aluminium gallium nitride (AlGaN) high-electron-mobility transistors (HEMTs) [Szu-Ping Tsai ...
Recycling and preparing for reuse of packaging waste is to be increased to 80% (by weight) by 2030 with individual materials? required to recycle more. Paper, ferrous metal, aluminium and glass have been set a 90% target while plastic ...
Tags: Packaging, Printing, Paper Recycling
After the recession in 2011 and 2012, the LED industry saw a turning point in 2013 when the die and package LED markets rose 8.3% from 2012 to about $15.188bn, according to the 'Global and China LED Industry Report, 2013-2014' from Research ...
Tags: LED market, LED
Valin ArcelorMittal Automotive Steel (VAMA) has forayed into the automotive manufacturing with the opening of a new advanced automotive steel plant in China with a total investment of CNY5.2bn ($832m) Located in the economic zone in Loudi ...
Global primary aluminum output, excluding China, averaged 67,500 mt/day in May, up from a revised 67,300 mt/day in April, but down from 68,100 mt/day in May 2013, figures released Friday by the International Aluminium Institute showed. ...
Tags: Aluminum, Aluminum Output
The global aluminium market has seen a remarkable improvement in its fundamental outlook, Bank of America Merrill Lynch said in a research note Thursday. "The improvement in market balances has perhaps been most outstanding for aluminium, ...
Tags: Aluminium, aluminium market
Russian aluminum producer Rusal said Monday that it is bullish on the near term prospects for the aluminium market and believes that the price is undervalued. "A number of influential factors that have emerged in recent weeks cause the ...
Tags: Aluminum Market, raw materials
The expo of customized technology for the aluminium and innovative metals industry, METEF, reaches its tenth edition, organized by Veronafiere, and will be held from 11 to 13 June 2014 in Verona. METEF will multiply exhibitor's ...
Tags: Footprints