Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has launched what it claims is the fastest gallium nitride (GaN) ...
Tags: Peregrine, GaN FET Driver
For fiscal third-quarter 2016 (to end-May), LED chip and component maker SemiLEDs Corp of Hsinchu, Taiwan has reported revenue of $2.38m (slightly below the expected $2.4-3m), down 18% on $2.92m last quarter and down 47% on $3.5m a year ...
Heinz Pickles have been at backyard BBQs, family parties, and in lunches and dinners for more than a century. This month Heinz will introduce its first new flavors of pickle chips in more than 50 years – Sweet & Spicy Pickle Chips ...
Tags: Heinz, Spicy Chips
Toyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed what is claimed to be the first 1.2kV-class power semiconductor device chip capable of large-current operation exceeding 20A. Picture: Forward current–voltage ...
The global light-emitting diode (LED) packaging equipment market will rise at a compound annual growth rate (CAGR) of almost 2% to more than $656m in 2020, according to a report by Technavio. The report considers the emergence of COB ...
Tags: LED, packaging equipment, COB
Emcore Corp of Alhambra, CA, USA – which provides indium phosphide (InP)-based optical chips, components, subsystems and systems for the broadband and specialty fiber-optics markets – has completed its strategic review and will ...
Tags: Emcore Corp, optical chips
Ghent University/IMEC in Belgium and X-Celeprint in Ireland/USA claim "the first III-V optoelectronic components transfer printed on and coupled to a silicon photonic integrated circuit" [Andreas De Groote et al, Optics Express, vol24, ...
Monolithic microwave integrated circuit developer Custom MMIC of Westford, MA, USA has added two new gallium arsenide (GaAs) MMIC BroadRange distributed amplifiers to its portfolio, for applications for including military/commercial ...
Tags: Custom MMIC, GaAs, monolithic microwave
ICT-STREAMS, a part of the European Union Horizon 2020 program, is a new three-year project launched on 1 February (followed by a kick-off meeting at the Aristotle University of Thessaloniki, Greece on 24-25 February) with the goal of ...
Tags: III-Vs-on-Si, silicon photonics
POET Technologies Inc of San Jose, CA, USA — which has developed the proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated III-V-based electronic and optical devices on a single ...
Tags: POET, BB Photonics, integrated photonic
Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...
Tags: LED, packaging equipment
For a fourth consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards resulting from VLSIresearch Inc's ...
Tags: EV Group, focused chip
By the end of 2016, more than half of all new automotive 77GHz radar systems worldwide will be equipped with chips from Munich-based Infineon Technologies AG, meaning that about one in 15 new cars will use a driver assistance system using ...
Ever more Taiwanese hand tool makers have ventured into the development of digital tools to secure sustainable growth, thanks to the nudging by ITRI.Development of digital tools has been regarded as one of Taiwan's hand tool industry's ...
Samsung Electronics Co Ltd of Seoul, Korea has launched Fx-CSP - a line-up of LED packages featuring chip-scale packaging (CSP) and flexible circuit board technology - for use in automotive lighting applications. "Our new Fx-CSP line-up ...