An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second ...
Tags: Electronic Component
Japanese computerized knitting machine producer, Shima Seiki will showcase its latest innovations in digital textile printing technology at Viscom Italia 2014 exhibition in Milan, Italy this October. Shima Seiki will display the ...
Currently, most flexible electronic and optoelectronic devices are fabricated using organic materials. However, for these devices inorganic compound semiconductors such as gallium nitride (GaN) can provide advantages over organic materials ...
Tags: LEDs, LED displays, Electrical, Electronics
Philips Lumileds of San Jose, CA, USA has expanded beyond its LED product offerings to include the Matrix Platform, consisting of turnkey LED solutions using components, optics and LUXEON LEDs assembled on a wide selection of board types. ...
Tags: Lumileds, Matrix Platform, LED Boards
At the 18th International Conference on Molecular Beam Epitaxy (MBE 2014) in Flagstaff, AZ, USA , Riber S.A. of Bezons, France, which manufactures molecular beam epitaxy (MBE) systems as well as evaporation sources and effusion cells, ...
Tags: Riber, MBE, Electrical
DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the newest release of Sherlock Automated Design Analysis™ software, version 3.2. This newest version of ...
Tags: Instruments, Meters
Obaly Morava, a privately-owned corrugated board producer based in the Czech Republic, had the press installed to boost supplies of its broad range of corrugated products to the Czech Republic and surrounding markets, including up to ...
Tags: HP, Packaging, Printing, Digital Printing
Researchers in USA and Saudi Arabia have been exploring the potential of using 'van der Waals epitaxy' (vdWE) to grow gallium arsenide (GaAs) on silicon [Yazeed Alaskar et al, Adv. Funct. Mater., published online 26 August 2014]. The team ...
Peter Gabriele, Vice President, Research and Development and Jeremy Harris, Ph.D., Technical Director, will present "Anatomy of a Next-Generation Bioresorbable Coating for Medical Devices" during a live webinar on Tuesday, September 23 at ...
Meijo and Nagoya universities in Japan have developed a laser lift-off (LLO) technique for removing gallium nitride (GaN) substrates from ultraviolet (UV) light-emitting diodes (LEDs) to improve light extraction efficiency [Daisuke Iida et ...
As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the thickness of these devices, and hence the thickness of the dies and wafers, says AI Technology Inc (AIT) of Princeton Junction, ...
Tags: Bonding Wax, Back-Grinding
Scott Bader Asia Pacific is exhibiting advanced composites at the 20th China International Composites Industrial Technical Expo (CCE 2014), taking place from 3-5 September at the Shanghai World Expo Exhibition & Convention Centre. This ...
Tags: Construction, Decoration
Researchers in Singapore have reported high-frequency performance of gallium nitride (GaN) indium aluminium nitride (InAlN) high-electron-mobility transistors (HEMTs) on silicon substrates, including the first noise measurements [S. ...
Tags: Electrical, Electronics
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue growth in 2015. Niching's LED products lines are ...
Tags: IC packaging, packaging material
LORD Corporation has announced the recipients of the 2014 President’s Circle Award. The inductees to the President’s Circle are Jim Nietupski, Key Account Manager, Sales & Marketing, Aerospace & Defense Eastern Regional Sales; ...
Tags: LORD Corporation, Award, Construction