John Bowers, a professor of electrical and computer engineering and of materials at University of California Santa Barbara (UCSB), has been selected to receive the 2017 Institute of Electrical and Electronics Engineers (IEEE) Photonics ...
Tags: Integrated Photonics, PICs
Due to rapid decline in cell prices, the mono and multi-Si wafer market witnessed weaker prices. Taiwanese manufacturers couldn’t tolerate prices above US$ 0.72/pc, which put pressures on wafer manufacturers. The average trading price ...
Tags: solar cell, PV
When the first SiC diode was launched in 2001, the industry questioned the future of the SiC power business: Will it grow? Is this a real business? But 15 years later, in 2016, people don't ask these questions anymore, since the SiC power ...
Tags: SiC Power, SiC device
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG50 automated metrology system. Designed to support the increasingly stringent manufacturing ...
Tags: Advanced Packaging, EV Group
The global light-emitting diode (LED) packaging equipment market will rise at a compound annual growth rate (CAGR) of almost 2% to more than $656m in 2020, according to a report by Technavio. The report considers the emergence of COB ...
Tags: LED, packaging equipment, COB
With the re-grouping of teams from III-V Lab (the joint Alcatel-Lucent, Thales and CEA-Leti industrial research laboratory), Almae Technologies SAS is taking over III-V Lab's facilities at Marcoussis, which is sited on the Plateau de Saclay ...
Tags: CEA-Leti, III-V Lab, laser components
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that optoelectronics manufacturer Xiamen Changelight Co Ltd of Xiamen, Fujian Province, China has finalized qualification of its AIX R6 Close Coupled ...
Tags: Aixtron SE, Changelight, MOCVD
The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
3D-Micromac AG of Chemnitz, Germany (which supplies laser micromachining systems and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets) says that its microDICE laser micromachining system has been ...
Tags: High-Power Diodes, power device
Ghent University/IMEC in Belgium and X-Celeprint in Ireland/USA claim "the first III-V optoelectronic components transfer printed on and coupled to a silicon photonic integrated circuit" [Andreas De Groote et al, Optics Express, vol24, ...
EpiGaN nv of Hasselt, near Antwerp, Belgium, which supplies commercial-grade 150mm- and 200mm-diameter gallium nitride on silicon (GaN-on-Si) epitaxial wafers, says that on 7 June it received official notification from the International ...
Kyma Technologies Inc of Raleigh, NC, USA (which provides crystalline nitride materials, crystal growth and fabrication equipment, and power switching electronics) and Quora Technology Inc have announced a strategic partnership in the ...
Tags: Kyma technologies, GaN, Quora
BluGlass Ltd of Silverwater, Australia – which was spun off from the III-nitride department of Macquarie University in 2005 to develop a low-temperature process using remote plasma chemical vapor deposition (RPCVD) to grow materials ...
In advance of the Citi Technology Conference on 9 June, engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA updated its investor presentation to note the sale of certain RF assets formerly owned by ...
Integrated passive device maker OnChip Devices Inc of Santa Clara, CA, USA says that its wafer fabrication facility is offering backside metallization (BSM) of thin films for applications such as military, medical, and instrumentation. ...
Tags: Sputtering, HB-LEDs, GaN-on-Si, Wafer bonding