EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material ...
Tags: Electrical, Electronics
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, and manufacturer of chemicals for the electronics industry Dynaloy LLC (a wholly owned subsidiary of Eastman Chemical Company) have introduced ...
Tags: lithography equipment, Electrical, Electronics, compound semiconductor
China-based researchers have reported that country's first diamond metal-semiconductor field-effect transistors (MESFETs) with RF characteristics [Feng ZhiHong et al, Science China Technological Sciences, vol56, p957, 2013]. The team was ...
Tags: Diamond MESFET MESFET Diamond, Electrical, Electronics
The new technology is a joint development with NOVALED AG (Dresden). The innovation allows defined customization or grey scaling of encapsulated standard OLEDs. It also enables to optimize lighting density and is also suitable to isolate ...
Tags: Laser Processing, Customized OLEDs
Fraunhofer Institute for Solar Energy Systems (ISE) in Freiburg, Germany (the largest solar energy research institute in Europe) has joined forces with EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography ...
Tags: Solar Cells, Electrical
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced the latest version of its EVG120 automated resist processing system. Incorporating new features and improved productivity in an ...
Suntron Corp of Phoenix, Arizona, USA, a supplier of integrated electronics manufacturing systems (EMS), says it offers a variety of manufacturing services, including large scale integration for semiconductor capital equipment firms. ...
Tags: Suntron, EMS Services, Semiconductor Firms
Back-end segment and the wafer-level packaging (WLP)-related segments ruled the semiconductor market during the year Global semiconductor capex on manufacturing equipment declined 16.1% during 2012 to $37.8bn compared to 2011, according ...
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing. To assess these uncertainties and provide the latest ...
Tags: 3D Transistors, Electronics
Institute of Electronic, Microelectronic and Nanotechnology (IEMN) in France has developed a gallium nitride (GaN) on silicon (Si) high-electron-mobility transistor (HEMT) with a power gain cut-off frequency of 220GHz and a three-terminal ...
Tags: GaN-on-Si HEMT, EpiGaN MOCVD PECVD
Samsung Electronics announced today that it has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using sub-20 nanometer (nm)-class process technology. The flash chip will be used to create Samsung's ...
Tags: Samsung Electronics, Flash Chip
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has deployed data acceleration software from Silver Peak Systems to accelerate data and applications cost-effectively between its global offices. ...
Tags: EV, Silver Peak Systems
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia. These trends will be explored at ...
Tags: Electrical, Electronics, semiconductor
Western Digital subsidiary HGST today announced the its first solid-state drives (SSD) that sport a 12Gbps serial-attached SCSI (SAS) interface. The 2.5-in., enterprise-class SSD family ups the SAS interface bandwidth by 2X and boosts ...
Tags: Electrical, Electronics
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and ...