FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment. The result of the project is a tool that can be ...
Tags: LED lighting, solar panels, LED
Mitsubishi Electric Corporation announced this week that it has developed a prototype multi-wire electrical discharge processing technology to cut very hard four inch square polycrystalline silicon carbide (SiC) ingots into 40 pieces at ...
LEDs are projected to grow more than six-fold to nearly $100 billion and power conversion electronics to $15 billion over the next decade as the desire for energy efficiency drives adoption, says Lux Research. While the market opportunity ...
Tags: Electrical, Electronics, Lights, LED
The Association of International Metallizers, Coaters and Laminators (AIMCAL) bestowed its Product of the Year Award on Graphic Packaging International, Inc., Atlanta, Georgia, for a microwaveable bacon package for Embotits Espina, a ...
Tags: AIMCAL, Bacon package, Graphic Packaging International
AGC (Asahi Glass Co., Ltd.; Head Office: Tokyo; President & CEO: Kazuhiko Ishimura) has made an investment totaling USD 2.1 million in Triton Microtechnologies, Inc. (Head Office: Arizona, U.S.), which owns cutting-edge via-fill technology ...
Tags: AGC, glass, ultra-thin glass
February 2013 — At the European Coatings Show from March 19 to 21, 2013, in Nuremberg, Bayer MaterialScience will present a technology for heat-activated dispersion adhesives that is based on the new polycarbodiimide crosslinker ...
Tags: Textile, Chemicals, Dispersed adhesives, polyurethane adhesive
St. Paul, Minn.– 3M introduces a new, revolutionary alternative to solvent based adhesives: 3M Fast Tack Water Based Adhesive 1000NF. While many adhesive users have been underwhelmed with water based products in the past, 3M Fast Tack ...
Tags: 3M, adhesives, 3M Fast Tack Water Based Adhesive 1000NF
Global specialty chemicals manufacturer Sartomer USA, LLC, now offers CN9062, a liquid high-functionality oligomer that brings significant scratch resistance to demanding coatings applications. This oligomer imparts excellent hardness to ...
Tags: Sartomer, CN9062, coatings applications
Researchers in Japan and Switzerland have used a laser treatment of sapphire substrates to increase the thickness of gallium nitride (GaN) layers grown by hydride vapor phase epitaxy (HVPE) to around 200μm [Hideo Aida et al, Appl. Phys. ...
Specialty metal and chemical product producer 5N Plus Inc of Montreal, Quebec, Canada has decided to close its indium antimonide (InSb) manufacturing operations in Trail, British Columbia over the next few months, laying off the 75 staff ...
Tags: 5N Plus, metal and chemical product, InSb manufacturing operations
AXT Inc of Fremont, CA, USA, which makes gallium arsenide, indium phosphide and germanium substrates and raw materials, has been certified as having met the international standards of ISO 16949:2009, a global standard developed by the ...
Tint-It JSC has acquired a license from Research Frontiers Inc. (Nasdaq: REFR), the developer and licensor of patented SPD-Smart light-control film technology. The non-exclusive license grants Tint-It the right to manufacture and sell ...
Tags: Tint-It JSC, SPD-Smart automotive and architectural products, Russia
As electronic technology has moved towards miniaturization, new manufacturing technologies have needed to be developed. Smaller components cannot always be connected or soldered by older conventional methods, such as flow soldering. At the ...
Tags: electronic technology, miniaturization, manufacturing technologies
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, says that it is developing equipment and process ...
AIXTRON SE has been awarded the 2013 Compound Semiconductor Manufacturing Award for its latest development, the AIX G5+ reactor for gallium nitride on silicon (GaN-on-Si). The Award recognizes key areas of innovation surrounding the chip ...