Japan's Rohm Semiconductor has announced the availability of a new 1700V silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) optimized for industrial applications, including manufacturing equipment and ...
Tags: SiC, MOSFET, manufacturing equipment
Toyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed what is claimed to be the first 1.2kV-class power semiconductor device chip capable of large-current operation exceeding 20A. Picture: Forward current–voltage ...
The global light-emitting diode (LED) packaging equipment market will rise at a compound annual growth rate (CAGR) of almost 2% to more than $656m in 2020, according to a report by Technavio. The report considers the emergence of COB ...
Tags: LED, packaging equipment, COB
With the re-grouping of teams from III-V Lab (the joint Alcatel-Lucent, Thales and CEA-Leti industrial research laboratory), Almae Technologies SAS is taking over III-V Lab's facilities at Marcoussis, which is sited on the Plateau de Saclay ...
Tags: CEA-Leti, III-V Lab, laser components
At its annual Imec Technology Forum (ITF) USA on 11 July, a half-day conference at the San Francisco Marriott Marquis hotel held in conjunction with the SEMICON West trade show and supported by industry association Semiconductor Equipment ...
Tags: IMEC, GaN-on-Si, III-Vs-on-silicon
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that optoelectronics manufacturer Xiamen Changelight Co Ltd of Xiamen, Fujian Province, China has finalized qualification of its AIX R6 Close Coupled ...
Tags: Aixtron SE, Changelight, MOCVD
Emcore Corp of Alhambra, CA, USA – which provides indium phosphide (InP)-based optical chips, components, subsystems and systems for the broadband and specialty fiber-optics markets – has completed its strategic review and will ...
Tags: Emcore Corp, optical chips
At a ceremony at the UK Engineering and Physical Sciences Research Council (EPSRC) National Centre for Power Electronics Annual Conference 2016 in Nottingham, UK, a post-graduate team from Imperial College London received the £2000 ...
Tags: GaN Systems, power conversion
The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
China XD Plastics Company, a manufacturer of polymer composite materials primarily for automotive applications, announced the commissioning of its new Sichuan manufacturing facility in China. China XD Plastics Company chairman of the ...
BorgWarner delivers its pre-emptive on-demand transfer case for multiple Jaguar models. Initially available for the new Jaguar XF, BorgWarner will also provide the all-wheel drive (AWD) technology for the Jaguar XE and F-PACE crossover. ...
Tags: AWD, Jaguar Land Rover, control systems
Swedish contract development and manufacturing organization (CDMO) Recipharm plans to invest €18m to boost its blow fill seal (BFS) capacity at its site in Kaysersberg, France. As part of the investment plan, a new blow fill seal ...
3D-Micromac AG of Chemnitz, Germany (which supplies laser micromachining systems and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets) says that its microDICE laser micromachining system has been ...
Tags: High-Power Diodes, power device
Researchers at University of California Santa Barbara (UCSB) and Rutgers University in the USA believe that charge polarization in III-nitride materials has not been adequately understood up to now [Cyrus E. Dreyer et al, Phys. Rev. X vol6, ...
Tags: semiconductors, Electronics
Flexible packaging provider Verso has introduced new GlazeTape water-activated and paint-masking tape base papers. The company has also expanded its GlazeWrap family of lightweight uncoated machine-glazed (MG) papers for food and medical ...
Tags: Paint-Masking Tape, Papers