M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) says that its RF Energy Toolkits are now available for order, ...
Tags: RF Systems, Macom
Bosch Packaging Technology has launched AFG 5000, a latest addition to its AFG series of filling and closing machines. The company will be showcasing the AFG 5000 in Crailsheim from September 18 through 29, 2017. The AFG 5000 filling ...
Tags: Bosch, Closing Machine
Hub Folding Box has chosen the EFI Packaging Suite from Electronics For Imaging (EFI), US, as its next-generation workflow solution. The EFI Packaging Suite features Radius ERP software as its core ERP technology. Hub Folding Box has ...
Tags: Hub Folding Box, EFI Packaging
As part of its continuing actions to improve profitability and cash flow, NeoPhotonics Corp of San Jose, CA, USA (a vertically integrated designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for ...
Tags: NeoPhotonics
With an aim to rival against the two best-known electronics giants, Apple and Google, Amazon.com Inc., an American e-commerce and cloud computing company based in Seattle, Washington, launched its latest version of smart speakers, ...
Tags: Amazon, Smart Speakers
Automakers Toyota and Mazda and auto components supplier Denso have signed a joint technology development contract for electric vehicles. The new company has been named EV C.A. Spirit Corporation to efficiently implement joint ...
Tags: Toyota, Mazda, Electric Vehicles
Belgium-based label printer Femalabel has invested in two Xeikon CX3 digital label presses, in a bid to enhance its production capacity. The installation of Xeikon aka Cheetah presses will allow Femalabel to expand the production of ...
Sustainable packaging solutions provider Ball has announced plans to stop the production of food cans at its packaging facility in Arkansas, US. The company intends to cease food can production at its tinplate food and aerosol packaging ...
Tags: Food Can, Sustainable packaging
Riber S.A. of Bezons, France, which manufactures molecular beam epitaxy (MBE) systems as well as evaporation sources and effusion cells, has confirmed revenue of €12.5m for first-half 2017, up 80% on €7m in first-half 2016 (and ...
Philips Photonics of Ulm, Germany - which provides vertical-cavity surface-emitting laser (VCSEL) technology for datacom, consumer and industrial applications - has completed ‘VIDaP’ (VCSEL Pilot Line for Illumination, Datacom ...
Epson America has introduced SurePress L-4533AW, a new product in the digital label press lineup. The L-4533AW delivers high-quality labels and packaging at a low total cost of ownership. The Epson MicroPiezo inkjet technology delivers ...
Tags: Epson, Digital Label Press
Kuka Robotics is showcasing packaging and palletizing solutions at this year’s Pack Expo event in Las Vegas, US. At the event, the company is exhibiting its robotic solutions, including KR 6 R900 Agilus robots. The company will ...
Tags: Kuka Robotics, packaging
Source Photonics Inc of West Hills, CA, USA (which provides broadband access optical components and modules) and the Jintan Economic Development Zone have announced the establishment of a new optical laser production plant in Jintan, China. ...
Tags: MOCVD, Source Photonics
At the International Conference on Silicon Carbide and Related Materials (ICSCRM 2017) in Washington DC (17-22 September), Tokyo-based Mitsubishi Electric Corp unveiled a silicon carbide (SiC) metal-oxide-semiconductor field-effect ...
Tags: Power Device, Mitsubishi, SiC Mosfet
At a roll-out event for customers and partners in Zurich, Flisom AG of Niederhasli, Switzerland – which has the Swiss Federal Laboratories for Materials Science and Technology (Empa) as a technology partner – showcased its ...
Tags: Solar Panels, PV