China's Nanjing University has produced silicon carbide (SiC) avalanche photodiodes (APDs) with the lowest claimed dark count rate (DCR) at high temperatures of 150°C, compared with any other semiconductor material [Dong Zhou et al, ...
Gartner brings more than thirty years of experience in manufacturing and engineering, including establishing and growing manufacturing operations for clean and reliable energy solutions. His expertise and experience will help transition ...
Tags: UV LED, commercial product
Researchers in Taiwan have produced zinc oxide/gallium nitride (ZnO/GaN) nano-rod light-emitting diodes [Ya-Ju Lee et al, APL Mater. vol2, p056101, 2014]. The researchers avoided complicated polymer processing by using a shadowing effect to ...
Tags: LED Fabrication, Zinc Oxide
POET Technologies Inc of Toronto, Canada – which, through subsidiary OPEL Defense Integrated Systems (ODIS Inc) of Storrs, CT, USA, has developed the proprietary planar-optoelectronic technology (POET) platform for monolithic ...
Tags: POET, Process Equipment
Microsemi Corp of Aliso Viejo, CA, USA (which designs and makes analog and RF devices, mixed-signal integrated circuits and subsystems) has introduced its new silicon carbide (SiC) MOSFET product family with new 1200V solutions. The new SiC ...
Pixelligent Technologies, a global manufacturer of advanced materials and PixClear™ nanocrystal dispersions for the solid state lighting and flat panel industries, announced today it has entered into a Cooperative Research and ...
Tags: DOE, Pixelligent Technologies
Advanced Tube Bending Maintains Latest-Generation Aircraft To maximize operational efficiency, British Airways maintains its fleet of aircraft in-house. The loss of revenue resulting from the grounding of a modern aircraft can be ...
EV Group (EVG) of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has shipped an EVG510 semi-automated wafer bonding system and an EVG620 automated bond ...
Tags: EV Group, wafer bonding system
Dow Corning Corp of Midland, MI, USA, which provides silicon and wide-bandgap semiconductor technology, has introduced a product grading structure for silicon carbide (SiC) crystal quality that specifies new tolerances on killer device ...
The world's second biggest steelmaker Japan-based Nippon Steel & Sumitomo Metal Corp. (NSSMC) has announced its financial results for the full financial year 2013-14 ended March 31, posting a net profit of JPY 242.75 billion ($2.4 billion), ...
Tags: Steel, Metallurgy, Mineral
Researchers based in USA and South Korea have developed a gate stack for III-V quantum well metal-oxide-semiconductor field-effect transistors (QW MOSFETs) based on a bilayer dielectric of beryllium oxide (BeO) and hafnium dioxide (HfO2) ...
Tags: InGaAs MOSFETs QW MOSFETs InGaAs ALD, Electrical, Electronics
Peregrine Semiconductor Corp of San Diego, CA, USA, a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-sapphire (SOS) and silicon-on-insulator (SOI), has shipped the first RF switches built on its ...
Scott Bader's Crystic Crestomer® 1196PA high performance urethane acrylate structural adhesive has recently been awarded a new certification approval by Det Norske Veritas AS (DNV) for its use in marine vessel construction. According to ...
Tags: adhesive, Chemicals, Construction
Massachusetts Institute of Technology (MIT) has demonstrated gallium nitride (GaN) vertical Schottky and p-n diodes on silicon Si substrates “for the first time” [Yuhao Zhang et al, IEEE Electron Device Letters, published online ...
Tags: GaN, MOCVD, Gallium Nitride Diodes
UNSW Australia researchers have invented a new type of tiny lab-on-a-chip device that could have a diverse range of applications, including to detect toxic gases, fabricate integrated circuits and screen biological molecules. The novel ...
Tags: Electrical, Electronics, Chip