Plasma etch and deposition equipment maker CORIAL S.A.S. of Bernin, France has announced the availability of hard materials deep etch processes using a new generation of 200mm ICP-RIE (inductively coupled plasma reactive-ion etch) ...
Tags: CORIAL S.A.S., Plasma etch, hard materials deep etch processes
EV Group of St Florian, Austria - a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS), compound semiconductors, power devices and nanotechnology applications says that a HERCULES ...
Tags: EV Group, NIL, EVG-Leti INSPIRE
Kaiam Corp of Newark, CA, USA - a private company founded in 2009 commercializing hybrid photonic integrated circuit (PIC) technology for pluggable optical transceivers in data-centers - has launched the new platform LightScale2. The ...
Tags: Kaiam, platform LightScale2, PIC technology
Mitsubishi Heavy Industries Machine Tool Co Ltd of Ritto City, Shiga, Japan (founded in October 2015), a group company of Tokyo-based machinery maker Mitsubishi Heavy Industries Ltd (MHI), has agreed with D-process Inc of Yamato, Kanagawa, ...
Tags: Mitsubishi Heavy Industries, D-process, room-temperature wafer bonding
Bühler Group has announced that it will expand the collaboration with German electronics manufacturer Bosch Connected Devices and Solutions for increased innovation and market launches. The Uzwil, Switzerland-based global process ...
Tags: Bühler, Bosch Connected Devices, Innovative Food Processing
For second-quarter 2016, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $75.3m, down 8.6% on $78m last quarter and 42.7% on $131.4m a year ago, consistent with ...
Tags: Veeco, LED industry
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG50 automated metrology system. Designed to support the increasingly stringent manufacturing ...
Tags: Advanced Packaging, EV Group
3D-Micromac AG of Chemnitz, Germany (which supplies laser micromachining systems and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets) says that its microDICE laser micromachining system has been ...
Tags: High-Power Diodes, power device
Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...
Tags: LED, packaging equipment
For a fourth consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards resulting from VLSIresearch Inc's ...
Tags: EV Group, focused chip
Ever more Taiwanese hand tool makers have ventured into the development of digital tools to secure sustainable growth, thanks to the nudging by ITRI.Development of digital tools has been regarded as one of Taiwan's hand tool industry's ...
Xaar launched the Xaar 5601 family of high resolution inkjet printheads which deliver a market-leading combination oftotal cost of ownership, print quality and usability. The Xaar 5601 3p0 is the first of this printhead family to be ...
ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment including Solstice electroplating systems (especially for emerging markets and other cost-conscious users of ≤200mm substrates), is reporting ...
Ireland's Tyndall National Institute (based at University College Cork) is leading the European consortium TOP-HIT (Transfer-print OPerations for Heterogeneous INtegration) to develop novel technology that will address the challenge of ...
Solmates of Science Park Twente in Enschede, The Netherlands (a spin-off from the MESA+ Institute of Nanotechnology) has received an order for one of its pulsed laser deposition (PLD) equipment systems from nanoelectronics research center ...