Bonderite duaLCys process exploits lubricant-cleaner synergies to reduce costs, boost performance, save energy, lower waste generation, and improve working conditions. When maintaining your metal machining tools and operations, what if ...
Tags: Bonderite duaLCys, Henkel, lubricant, cleaner
BASF is presenting numerous new solutions for the packaging and furniture industry, automotive and electrical engineering at this year’s Fakuma, the international trade fair for plastics processing, in Friedrichshafen. From October ...
Tags: BASF, Plastics, polyurethanes
Amcor and Bosch Packaging Technology have partnered to develop ZipSpeed, an optimal material that has been designed to run on Bosch's new SVE 2520DZ vertical Doy Zip bag machine. ZipSpeed has been developed to match the performance of ...
Tags: Amcor, Bosch Packaging, Doy Zip Bagger
As the demand for plastic sorting solutions continues to soar, C, a member of The Bühler Group, and US-based National Recovery Technologies (NRT) are entering a strategic commercial agreement to offer plastics recyclers a complete ...
At the International Symposium on Automotive Lighting (ISAL 2015) in Darmstadt, Germany (29–30 September), Osram Opto Semiconductors GmbH of Regensburg, Germany is unveiling the Oslon Black Flat S, a surface-mount technology (SMT) LED ...
Tags: Osram Oslon, LED, Semiconductors, headlamps
Nissan has unveiled the 2016 Altima, which has been given a new design and technical upgrades. The car is a part of the company's new design language, which formed the base of the new versions of Maxima and Murano. The new Altima has ...
Researchers based in China and Canada have developed single-mode ridge waveguide Fabry-Perot (RW FP) laser diodes using a pair of etched trenches that are slanted to reflect out unwanted wavelengths [Xun Li et al, Appl. Phys. Lett., vol107, ...
Tags: laser diodes, packages
UK-based Plessey has developed a patented technology for chip-scale optics (CSO) based on its gallium nitride on silicon MaGIC (Manufactured on GaN-on-Si I/C) LEDs. Chip-scale optics permits the design of light emission angles down to ...
Tags: Plessey, GaN-on-Si LEDs, silicon, CSO technology
BASF is expanding its range of engineering plastics for the dynamic market of electric and hybrid vehicles. Tailor-made Ultramid® and Ultradur® materials are now available globally for equipping vehicle-interior and -exterior ...
Tags: BASF, engineering plastics, coolants, flame retardant
The stylish and compact hybrid crossover Toyota C-HR concept has been updated, as the company plans to launch a mass-market version in the not-so-distant future. The Toyota C-HR Concept was created to explore new directions for compact ...
Tags: compact hybrid, Toyota
Drivers of Ford electric and plug-in hybrid vehicles can now access their battery charge status, unlock their doors and get a driving score from their last trip with the MyFord Mobile application for smartwatches. "The app gives drivers ...
Tags: hybrid vehicles, Smartwatch, smartphones
AquiSense Technologies of Florence, KT, USA, which designs and manufactures UV-C LED systems, has unveiled the PearlAqua UV-C LED water disinfection system, which incorporates UV-C LEDs into a compact water treatment unit, without the use ...
Tags: UV, LEDs, disinfection products
The Pro Mach End of Line Group, showcases at Pack Expo Las Vegas 2015, September 28-30, a host of stand-alone and integrated systems from such brands as Brenton, Currie by Brenton, DEKKA, Edson, IPak, Orion, and Wexxar/BEL. The Pro Mach ...
Tags: integrated case packing, robotic palletizing, stretch wrapping line
Matrix Packaging Machinery, powered by Pro Mach, features for the first time at Pack Expo Las Vegas, September 28-30, a new option for FLtecnics horizontal form fill seal pouch machines – the capability to form top or corner spout ...
Tags: Matrix Packaging, pouch, Pack Expo Las Vegas
SüSS MicroTec AG of Garching, near Munich, Germany, a supplier of equipment and process solutions for microstructuring in semiconductor and related markets, has launched the XB8 bonding platform. Designed for a wide range of bonding ...
Tags: SüSS MicroTec, Wafer bonding, semiconductor