The addressable market for chip-level optical interconnects could eventually run into billions of units, as revenues rise to almost $520m by 2019 then $1.02bn by 2021, according to the report 'Revenue Opportunities for Optical ...
CEA-Leti spin off Aledia, has made its first GaN LEDs on 8 inch (200mm) silicon wafers. The cost of Aledia’s LED 3D chips based on microwires is expected to be four times less than traditional planar (2D) LEDs. What's more, Aledia ...
Tags: LED 3D Chips, LED, LED chips
Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers. The cost of Aledia’s LED 3D chips based on microwires is expected ...
Tags: Aledia, LED, Silicon Wafers, Microwire Technology
TSMC and Imagination Technologies are working together to develop reference design flows and silicon implementations for Imagination’s PowerVR Series6 GPUs on TSMC’s advanced process technologies, including 16nm FinFET process ...
Tags: Graphics Chip, Consumer Electronics, TSMC
Cadence is working with foundry TSMC on a tool chain and process for 3D chip designs. 3D chip design incorporates multi-chip packages and even multi-die devices with through silicon via(TSV)interconnect technologies.This requires that the ...
Tags: TSMC and Cadence, 3D Chips, intellectual property, through silicon via